5SGXEA4H2F35C3NCV

The 5SGXEA4H2F35C3NCV is a Stratix V GX Field Programmable Gate Array (FPGA) in a 1152‑BBGA (35×35) package optimized for high‑density, high‑I/O digital designs. It integrates 420,000 logic elements and substantial embedded memory, making it suitable for complex custom logic, high‑channel I/O implementations, and advanced system integration in commercial applications.

Designed for surface‑mount assembly with a commercial temperature grade, this device offers a wide I/O complement and tightly specified core supply requirements for predictable system behavior.

Key Features

• Core Logic  Approximately 420,000 logic elements to implement large FPGA designs and dense custom hardware functions.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM to support buffering, LUTs, and data‑path storage without external memory in many designs.
• I/O Capacity  552 user I/O pins providing broad connectivity for parallel interfaces, host links, and board‑level integration.
• Package & Mounting  1152‑BBGA (FCBGA) supplier package (1152‑FBGA, 35×35) in a surface‑mount form factor for high‑pin‑density PCB layouts.
• Power Supply  Core supply range specified at 820 mV to 880 mV to match system power rails and enable controlled power budgeting.
• Operating Range  Commercial grade operation from 0 °C to 85 °C for standard embedded and commercial environments.
• Regulatory Compliance  RoHS compliant, supporting restricted‑substance requirements for modern electronics manufacturing.

Typical Applications

• Custom Logic Acceleration  Implement application‑specific accelerators and offload tasks from CPUs using the device’s large logic and memory resources.
• High‑Density I/O Systems  Manage multi‑lane or multi‑channel interfaces and complex board interconnects with 552 I/O pins.
• Data Processing and Buffering  Use embedded memory for packet buffering, streaming data handling, and intermediate storage in throughput‑focused designs.
• Prototyping and System Integration  Develop and validate large FPGA designs that require substantial logic, RAM, and flexible I/O in a single commercial‑grade device.

Unique Advantages

• High Logic Density: 420,000 logic elements allow consolidation of complex functions into a single FPGA, reducing BOM and board complexity.
• Significant On‑Chip Memory: Approximately 37.9 Mbits of embedded RAM minimizes dependence on external memory for many buffering and data‑path needs.
• Large I/O Count: 552 I/O pins provide flexibility for diverse interface requirements and simplify routing of parallel signals.
• Compact High‑Pin Package: 1152‑BBGA (35×35) delivers high connectivity in a compact surface‑mount form factor suitable for dense PCB layouts.
• Controlled Power Envelope: Narrow core voltage range (820 mV–880 mV) supports stable power design and predictable thermal behavior.
• Commercial Grade: Rated for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial product deployments.

Why Choose 5SGXEA4H2F35C3NCV?

The 5SGXEA4H2F35C3NCV Stratix V GX FPGA combines substantial logic capacity, abundant embedded memory, and a high number of I/O pins in a single 1152‑BBGA surface‑mount package. It is positioned for commercial designs that require dense programmable logic, on‑chip storage, and broad board‑level connectivity while maintaining controlled power requirements and RoHS compliance.

This device is well suited to engineers and system designers building complex digital systems, high‑channel I/O solutions, or custom accelerators who need a reliable, high‑density FPGA platform with clearly specified electrical and environmental characteristics.

Request a quote or submit an inquiry for pricing and availability to begin evaluation and integration of the 5SGXEA4H2F35C3NCV into your next design.