5SGXEA4H2F35C3N

The 5SGXEA4H2F35C3N is a Stratix® V GX field programmable gate array (FPGA) from Intel, delivered in a 1152‑FBGA (35×35) surface‑mount package for commercial‑grade deployments. It provides a high logic capacity and significant embedded memory, combined with a large I/O count and a tightly specified core voltage range for integrated digital designs.

This device targets designs that require large on‑chip logic and memory resources in a compact BGA footprint, operating within commercial temperature limits and RoHS compliance.

Key Features

• Logic Capacity  Approximately 420,000 logic elements and 158,500 logic blocks provide substantial programmable logic resources for complex digital implementations.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM to support large buffering, state storage, and block memory functions.
• I/O Capability  Up to 552 user I/O pins to support high‑pin‑count interfaces and dense board connectivity.
• Package and Mounting  1152‑BBGA / FCBGA package (supplier package listed as 1152‑FBGA, 35×35) in a surface‑mount form factor for compact PCB integration.
• Power and Voltage  Core supply specified from 820 mV to 880 mV, enabling designers to target the defined operating window for power delivery and thermal planning.
• Operating Range and Grade  Commercial grade device rated for 0 °C to 85 °C ambient operating temperature and RoHS compliant.

Typical Applications

• High‑density logic designs  Systems requiring approximately 420,000 logic elements and extensive on‑chip RAM for complex control, processing, or compute‑intensive functions.
• High I/O systems  Board designs that need up to 552 I/Os for parallel interfaces, multi‑lane connections, or dense peripheral integration.
• Compact, high‑capacity FPGA deployments  Applications that benefit from a large FPGA in a 1152‑FBGA (35×35) package for space‑constrained PCBs.
• Commercial electronic products  Designs operating within a 0 °C to 85 °C range and requiring RoHS‑compliant components.

Unique Advantages

• Large programmable fabric: Enables implementation of complex logic, state machines, and custom datapaths with approximately 420,000 logic elements.
• Substantial embedded memory: Approximately 37.9 Mbits of on‑chip RAM reduces reliance on external memory for many buffering and storage needs.
• High I/O density: 552 I/Os support extensive peripheral connectivity and multi‑interface designs without additional interface chips.
• Optimized package option: 1152‑FBGA (35×35) package balances high pin count with a compact PCB footprint for space‑constrained systems.
• Commercial temperature and RoHS compliance: Suited for commercial‑grade deployments with standardized environmental and regulatory expectations.
• Tightly specified core voltage: 820 mV to 880 mV supply range supports precise power delivery design and system stability.

Why Choose 5SGXEA4H2F35C3N?

The 5SGXEA4H2F35C3N offers a combination of high logic density, significant embedded memory, and a large I/O complement in a compact 1152‑FBGA package—making it a practical choice for commercial systems that need substantial programmable resources in a constrained board area. As a member of Intel's Stratix V GX family, it is positioned for designs that require robust on‑chip capacity and defined operating characteristics.

This device is appropriate for customers building advanced digital systems who prioritize integration (logic + RAM + I/O), clear electrical requirements (core voltage range), and commercial temperature operation, with the benefit of RoHS compliance for regulatory alignment.

Request a quote or submit a procurement request to evaluate 5SGXEA4H2F35C3N for your next design project and confirm supply, lead time, and pricing through your preferred purchasing channel.