5SGXEA4H2F35I2L

The 5SGXEA4H2F35I2L is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, offered in an industrial temperature grade and supplied in a 1152‑BBGA FCBGA package. This device provides high-density programmable logic and on-chip RAM for systems that require substantial logic integration, large I/O counts, and a low-voltage core supply.

Designed for surface-mount assembly and RoHS-compliant manufacturing, the device targets designs that need extensive embedded memory, abundant I/O pins, and operation across a wide industrial temperature range.

Key Features

• High Logic Density 420,000 logic elements (cells) to implement complex combinational and sequential logic functions.
• Embedded Memory Approximately 38 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive logic blocks.
• Extensive I/O 552 user I/O pins to enable wide interfacing options for peripherals, sensors, and high-pin-count subsystems.
• Power and Core Voltage Core supply range specified at 820 mV to 880 mV for compatibility with low-voltage power architectures.
• Package and Mounting 1152‑BBGA (FCBGA) supplier device package: 1152‑FBGA (35×35); surface-mount package suitable for high-density PCB designs.
• Industrial Temperature Range Rated for operation from –40 °C to 100 °C for deployment in industrial environments.
• Compliance RoHS compliant to meet lead-free manufacturing requirements.

Typical Applications

• Industrial Control and Automation The industrial temperature grade (–40 °C to 100 °C) and high logic density make this FPGA suitable for control, sequencing, and custom logic in industrial equipment.
• High‑Density Logic Integration Large logic element count and substantial on-chip RAM enable consolidation of multiple functions into a single programmable device.
• Systems with High Pin‑Count Requirements 552 I/O pins support complex board-level interfacing, sensors, and parallel data buses.

Unique Advantages

• Highly integrated programmable fabric: 420,000 logic elements reduce the need for multiple discrete logic devices.
• Significant on‑chip memory: Approximately 38 Mbits of RAM supports large buffers and local data storage, simplifying board routing and external memory requirements.
• Ample I/O resources: 552 user I/O pins provide flexibility for diverse peripheral and bus interfaces.
• Low-voltage core operation: 820 mV–880 mV core supply aligns with modern low-voltage power supplies for efficient system design.
• Industrial-grade thermal window: –40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Surface-mount BGA package: 1152‑BBGA (35×35) enables compact board layouts and high routing density.

Why Choose 5SGXEA4H2F35I2L?

The 5SGXEA4H2F35I2L combines substantial logic capacity, significant embedded memory, and a broad I/O complement in an industrial-grade Stratix V GX FPGA package. Its low-voltage core and surface-mount 1152‑BBGA footprint make it suitable for designs that require high integration density while meeting industrial temperature and RoHS requirements.

This part is well suited to engineers and system designers who need a programmable platform with large-scale logic resources, on-chip RAM, and extensive connectivity for complex, space-constrained electronic systems.

Request a quote or submit an inquiry for pricing and availability to begin integrating the 5SGXEA4H2F35I2L into your next design.