5SGXEA4H3F35C2G

The 5SGXEA4H3F35C2G is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel. It provides a large, programmable logic fabric combined with significant on-chip memory and extensive I/O in a 1152-BBGA (1152-FBGA, 35×35) FCBGA package.

Designed for systems requiring dense logic, embedded memory, and substantial I/O capacity, this commercial-grade device operates from 870 mV to 930 mV and across a 0 °C to 85 °C temperature range. The Stratix V family datasheet also documents transceiver speed grade support across multiple channel rates for GX devices.

Key Features

• Logic Capacity — 420,000 logic elements (cells) suitable for large-scale, programmable digital designs.
• Embedded Memory — Approximately 37.9 Mbits of on-chip RAM for buffering, lookup tables, and data storage close to logic.
• Logic Array Blocks — 158,500 LABs/CLBs providing the architecture for implementing complex logic functions.
• I/O Density — 552 I/O pins to support extensive board-level interfacing and parallel connectivity.
• Package & Mounting — 1152-BBGA (1152-FBGA, 35×35) in an FCBGA form factor; surface-mount package for PCB assembly.
• Power Supply — Core voltage supply range from 870 mV to 930 mV for device operation.
• Operating Conditions — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Standards Compliance — RoHS compliant for environmental and materials requirements.
• Stratix V GX Transceiver Capability — The Stratix V GX family supports multiple transceiver speed grades, as documented in the device datasheet.

Typical Applications

• High‑speed serial interfaces — Implement protocol stacks and serial link endpoints using the Stratix V GX transceiver capabilities defined in the family datasheet.
• Large-scale digital processing — Deploy substantial custom logic and data pipelines leveraging 420,000 logic elements and embedded RAM.
• I/O‑intensive systems — Integrate multiple peripherals and board-level interfaces using 552 available I/O pins.

Unique Advantages

• Large programmable fabric: 420,000 logic elements enable implementation of complex, custom digital functions without discrete ASIC development.
• Significant on‑chip memory: Approximately 37.9 Mbits of embedded RAM reduces external memory needs and improves data locality.
• Extensive I/O: 552 I/O pins facilitate flexible system integration and parallel connectivity options.
• Commercial operating envelope: Specified for 0 °C to 85 °C operation and RoHS compliant for broad deployment in commercial applications.
• Robust packaged form: 1152-BBGA (35×35) FCBGA surface-mount package supports compact board designs while providing high pin count.

Why Choose 5SGXEA4H3F35C2G?

The Intel Stratix V GX 5SGXEA4H3F35C2G combines a large logic element count, substantial embedded memory, and high I/O density in a single commercial-grade FPGA package. Its documented Stratix V GX family capabilities for transceiver speed grades and the device’s power and temperature specifications make it suitable for designs that require integrated programmable logic with significant memory and interface resources.

This part is well suited to engineers and teams building complex digital systems that need scalability in logic and memory, broad I/O, and support from the Stratix V device documentation and ecosystem.

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