5SGXEA4H3F35C2LN

The 5SGXEA4H3F35C2LN is a commercial-grade Stratix® V GX Field Programmable Gate Array (FPGA) IC. It provides high logic density and a substantial on-chip memory footprint in a 1152-ball FCBGA package for surface-mount assembly.

With approximately 420,000 logic elements, around 38 Mbits of embedded RAM and 552 user I/O, this device targets high-density, I/O-rich digital designs where integration and configurable logic resources are required within a commercial temperature range.

Key Features

• Core density — Approximately 420,000 logic elements to support large-scale custom logic, parallel datapaths and complex state machines.
• Embedded memory — Total on-chip RAM of 37,888,000 bits (approximately 38 Mbits) for buffers, FIFOs and memory-intensive functions.
• I/O capacity — 552 user I/O pins for high-pin-count interfacing and multi‑channel connectivity.
• Family transceiver options (Stratix V GX) — The Stratix V GX family is offered in commercial transceiver speed grades as described in the device documentation.
• Power supply — Core voltage supply range of 820 mV to 880 mV to match system power architectures.
• Package and mounting — 1152-BBGA / FCBGA package (supplier device package: 1152-FBGA, 35×35 mm) for surface-mount PCB assembly.
• Commercial operating range — Rated for 0 °C to 85 °C operation and designated as a commercial-grade device.
• RoHS compliant — Meets lead-free and restricted-substance requirements.

Typical Applications

• High-density digital processing — Use the large logic resource pool and on-chip RAM to implement complex algorithms, packet processing and custom accelerators in commercial systems.
• Multi-interface aggregation — 552 I/O pins accommodate multi-protocol bridging, interface aggregation and wide parallel buses for I/O‑heavy designs.
• Memory-centric logic — Approximately 38 Mbits of embedded memory supports buffering, look-up tables and state storage for data-path and control logic implementations.

Unique Advantages

• High integration density: Large logic element count enables consolidation of multiple functions into a single device, simplifying system architecture.
• Substantial embedded memory: Nearly 38 Mbits of on-chip RAM reduces dependence on external memory for many buffering and temporary storage needs.
• Extensive I/O capability: 552 I/O pins support complex interfacing requirements without immediate need for I/O expanders.
• Compact, manufacturable package: 1152-ball FCBGA in a 35×35 mm footprint offers a balance of pin count and board-space efficiency for surface-mount assembly.
• Commercial temperature rating: Designed for 0 °C to 85 °C operation to match a wide range of commercial-system environments.
• Standards-conscious supply: RoHS compliance supports modern environmental and manufacturing requirements.

Why Choose 5SGXEA4H3F35C2LN?

The 5SGXEA4H3F35C2LN delivers a combination of high logic capacity, substantial embedded memory and a large I/O complement in a surface-mount FBGA package, positioned for demanding commercial applications that require dense, configurable logic and robust interfacing. Its Stratix V GX family lineage provides documented transceiver and speed-grade options at the family level, while the device’s electrical and thermal ratings support reliable operation across standard commercial environments.

This part is suited for design teams needing high integration and flexible hardware programmability to consolidate multiple functions, reduce board-level complexity and accelerate time-to-market using a commercially rated FPGA platform.

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