5SGXEA4H3F35C2WN

The 5SGXEA4H3F35C2WN is a Stratix® V GX FPGA in a 1152‑BBGA (35×35) package, offering very high logic density and extensive I/O for complex digital designs. As a commercial‑grade, surface‑mount FPGA, it combines large logic capacity, substantial embedded RAM, and family‑level high‑speed transceiver capability for demanding applications.

Key Features

• Core Capacity  Approximately 420,000 logic elements, providing substantial on‑chip programmable logic for large-scale designs.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM to support buffering, frame storage, and memory‑intensive algorithms.
• I/O and Package  552 user I/Os in a 1152‑BBGA (1152‑FBGA, 35×35) package, enabling wide parallel interfacing and dense board routing; surface mount mounting type.
• Transceiver Capability (Series Detail)  Stratix V GX devices include high‑speed transceiver options documented in the device datasheet (for example, some GX channel speed grades support up to 14.1 Gbps), enabling serial link integration where required.
• Power and Core Voltage  Core voltage supply range specified at 870 mV to 930 mV, supporting the device's defined operating conditions.
• Operating Range & Grade  Commercial temperature grade with an operating temperature range of 0°C to 85°C, suitable for commercial‑environment deployments.
• Compliance  RoHS compliant to meet standard environmental requirements.

Typical Applications

• High‑speed communications  Use the device where high‑speed serial links and extensive I/O are required; Stratix V GX family transceiver options support multi‑Gbps channel rates as documented in the device datasheet.
• Network and packet processing  Large logic capacity and substantial embedded RAM enable packet buffering, classification, and custom network processing functions.
• Signal and image processing  Dense logic and on‑chip memory support real‑time filtering, frame buffering, and parallel processing pipelines.
• High‑density system integration  The 552 I/Os and FBGA package make the device suitable for designs that require many external interfaces and compact board layouts.

Unique Advantages

• High logic density: Approximately 420,000 logic elements reduce the need for multiple devices when implementing large designs.
• Significant on‑chip memory: Approximately 37.9 Mbits of embedded RAM supports buffering and local data storage without external memory in many use cases.
• Extensive I/O footprint: 552 user I/Os in a 1152‑BBGA package provide flexible connectivity for complex interface requirements.
• Defined operating and supply specs: Documented core supply range (870 mV–930 mV) and commercial temperature rating (0°C–85°C) help streamline power budgeting and thermal planning.
• RoHS compliant: Meets common environmental compliance needs for commercial products.

Why Choose 5SGXEA4H3F35C2WN?

This Stratix V GX FPGA delivers a combination of high logic capacity, substantial embedded memory, and a large I/O count in a compact 1152‑BBGA package, making it well suited to commercial designs that require dense programmable logic and extensive interfacing. Its specified core voltage range and documented family transceiver capabilities provide a clear basis for power and high‑speed serial link planning.

The device is appropriate for customers building complex communications, networking, signal processing, or high‑density integration solutions who need a verified, commercial‑grade FPGA platform with large on‑chip resources and RoHS compliance.

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