5SGXEA4H3F35C4N

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 37888000 420000 1152-BBGA, FCBGA

Quantity 172 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXEA4H3F35C4N – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXEA4H3F35C4N is a Stratix V GX family FPGA from Intel, offered in a 1152-BBGA (FCBGA) package. It provides a high-density programmable logic fabric with a large embedded memory complement and a broad I/O count, targeted at demanding commercial designs that require significant on‑chip logic and I/O resources.

Key value derives from its dense logic capacity, substantial on‑chip RAM, and support for Stratix V GX transceiver speed grades documented for the family, enabling complex data-paths and high‑I/O integration within a single device package.

Key Features

  • Core logic density — 420,000 logic elements to implement large-scale programmable logic, datapaths, and custom accelerators.
  • On‑chip memory — Approximately 37.9 Mbits of embedded memory for buffering, FIFO, and local storage across complex designs.
  • I/O resources — 552 device I/Os to support wide parallel interfaces, multi‑lane buses, and dense board routing.
  • Transceiver family capabilities — As a Stratix V GX device, the family includes transceiver speed grades (for example, up to 14.1 Gbps in GX grades) as documented in the Stratix V device datasheet.
  • Power and supply — Core voltage range of 820 mV to 880 mV for the programmable core supply domain.
  • Package and mounting — 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35); surface mount compatible for standard PCB assembly.
  • Commercial temperature grade — Rated for 0 °C to 85 °C operating temperature.
  • Standards compliance — RoHS compliant.

Typical Applications

  • High‑performance signal processing — Large logic density and substantial embedded RAM support complex algorithms, DSP pipelines, and real‑time data manipulation.
  • Data‑plane and networking functions — Family transceiver capabilities and high I/O count enable implementation of multi‑lane interfaces and packet processing engines.
  • Custom hardware acceleration — Dense logic resources and on‑chip memory allow offloading compute‑intensive kernels into programmable fabric.

Unique Advantages

  • High integration in a single device: Combines 420,000 logic elements and large on‑chip RAM to minimize external components and simplify system partitioning.
  • Extensive I/O headroom: 552 I/Os provide flexibility for wide buses, peripheral expansion, and mixed‑signal front‑ends on the same board.
  • Family transceiver options: Stratix V GX family transceiver grades documented in the datasheet support high‑speed links where required by the design.
  • Compact package footprint: 1152‑ball FCBGA (35×35) enables dense board integration while preserving routing capability for complex systems.
  • Commercial operating range: Rated for 0 °C to 85 °C to match mainstream commercial deployments and environments.
  • RoHS compliance: Conforms to RoHS environmental requirements for lead‑free assembly and regulatory alignment.

Why Choose 5SGXEA4H3F35C4N?

This Stratix V GX device is positioned for commercial designs that demand substantial programmable logic, abundant on‑chip memory, and high I/O density in a single FCBGA package. It suits teams implementing complex datapaths, custom accelerators, and multi‑lane interfaces where integrating logic and memory on‑chip reduces board complexity and BOM count.

Backed by Intel’s Stratix V device family documentation and available transceiver speed grades, the part provides a scalable platform for advanced FPGA projects where performance, integration density, and design flexibility are primary considerations.

Request a quote or contact sales to discuss availability, lead times, and volume pricing for 5SGXEA4H3F35C4N.

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