5SGXEA4H3F35C4WN

The 5SGXEA4H3F35C4WN is a Stratix® V GX FPGA from Intel, delivering high on-chip logic capacity and embedded memory in a 1152-ball FCBGA package. It targets commercial applications that require large logic fabrics, abundant I/O, and significant on-chip RAM for complex programmable logic designs.

With 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and 552 user I/O pins, this device is suited for designs that need dense logic resources, substantial local storage, and extensive interface connectivity while operating within a commercial temperature range.

Key Features

• Core Capacity  420,000 logic elements provide a large programmable fabric for high-density digital logic integration.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM for buffering, FIFOs, and fast local storage close to logic.
• I/O Resources  552 general-purpose I/O pins to support multiple parallel interfaces and dense external connectivity.
• Power Supply  Specified core voltage supply range of 820 mV to 880 mV for the device core.
• Package & Mounting  1152-ball FCBGA (35×35) package, surface-mount construction for modern PCB assembly.
• Operating Conditions  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic  Use where extensive logic resources are required to implement complex custom datapaths and control fabrics.
• Memory-intensive functions  Embedded RAM supports on-chip buffering and storage for packet processing, data aggregation, and streaming tasks.
• I/O-dense systems  Large I/O count enables multi-lane interfaces, parallel sensor arrays, or broad peripheral integration.
• Commercial embedded platforms  Designed for commercial-temperature deployments requiring substantial integration in a single FPGA package.

Unique Advantages

• High logic density: 420,000 logic elements let you consolidate larger designs into a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM minimizes external memory dependence and improves data throughput.
• Extensive I/O: 552 I/O pins support a wide range of parallel and serial interfaces without extensive external multiplexing.
• Compact FCBGA packaging: 1152-ball FCBGA (35×35) enables a compact footprint for high-density PCB designs.
• Commercial operating range: 0 °C to 85 °C rating aligns with standard commercial system deployments.
• Regulatory compliance: RoHS compliance supports modern environmental and manufacturing requirements.

Why Choose 5SGXEA4H3F35C4WN?

The 5SGXEA4H3F35C4WN provides a combination of large logic capacity, significant on-chip memory, and a high I/O count in a single commercial-grade Stratix V GX device. Its specifications make it appropriate for engineers and system designers who need to implement complex logic, substantial buffering, and broad connectivity while maintaining a compact board footprint.

Backed by the Stratix V GX family heritage and Intel manufacturing, this FPGA is positioned for commercial embedded systems where scalability, integration, and predictable electrical characteristics (including defined core voltage and temperature ranges) are important design considerations.

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