5SGXEA4H3F35I3LN

The 5SGXEA4H3F35I3LN is a Stratix® V GX field programmable gate array (FPGA) IC designed for applications that require high programmable logic density, significant on‑chip memory, and abundant I/O in an industrial temperature grade. This device integrates a large logic fabric and embedded memory with a BG A package optimized for surface‑mount assembly, making it suitable for dense system designs where board space and thermal management are considerations.

Targeted at designs that demand a combination of capacity and robust operating range, the device supports industrial use with an operating temperature range of –40 °C to 100 °C and RoHS compliance for environmental compatibility.

Key Features

• Logic Capacity — 420,000 logic elements to implement large, complex digital designs and custom accelerators.
• Embedded Memory — Approximately 38 Mbits of on‑chip RAM for buffering, lookup tables, and state storage.
• I/O Density — 552 user I/Os to support wide parallel interfaces, multiple peripherals, and complex board-level connectivity.
• Package & Mounting — 1152‑BBGA / 1152‑FBGA (35×35) FCBGA package, surface‑mount for high‑density PCB integration.
• Power Supply — Core supply range of 820 mV to 880 mV to match targeted power domains and system power architectures.
• Temperature & Grade — Industrial grade with an operating temperature range of –40 °C to 100 °C for demanding environments.
• Regulatory — RoHS compliant for environmentally regulated designs.

Typical Applications

• Industrial Control & Automation — Large logic capacity and industrial temperature rating enable complex control algorithms, sensor interfacing, and deterministic I/O handling in factory and process environments.
• High‑Density Communications — Ample logic resources, embedded memory, and extensive I/O make the device suitable for implementing packet processing, framing, and protocol handling in networking equipment.
• Data Processing & Acceleration — High logic count and on‑chip RAM support custom accelerators, DSP pipelines, and workload offload functions in compute‑adjacent systems.
• Prototyping & System Integration — The FCBGA package and large I/O count facilitate integration of multiple interfaces and peripherals for proof‑of‑concept and development platforms.

Unique Advantages

• High Logic Density: 420,000 logic elements allow consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial On‑Chip Memory: Approximately 38 Mbits of embedded RAM minimize external memory dependencies for latency‑sensitive tasks.
• Extensive I/O Count: 552 I/Os provide flexibility for parallel buses, multi‑lane interfaces, and numerous peripheral connections without additional interface chips.
• Industrial Reliability: Rated for –40 °C to 100 °C operation to meet requirements of industrial deployments and extended temperature environments.
• Space‑Efficient Packaging: 1152‑BBGA / 1152‑FBGA (35×35) package supports high pin counts in a compact footprint for dense PCB layouts.
• Environmental Compliance: RoHS compliance supports regulatory requirements for many global markets.

Why Choose 5SGXEA4H3F35I3LN?

The 5SGXEA4H3F35I3LN positions itself as a high‑capacity, industrial‑grade Stratix V GX FPGA suited to projects that require large programmable logic, significant embedded memory, and a high number of I/Os within a compact BGA package. Its core supply and thermal rating address power and environmental constraints common to long‑lifecycle industrial and communications systems.

This device is appropriate for engineering teams building complex digital systems that need to consolidate multiple functions into a single programmable device while maintaining the flexibility to iterate and scale designs within the Stratix V family framework.

Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time information for the 5SGXEA4H3F35I3LN.