5SGXEA4H3F35I3G

The 5SGXEA4H3F35I3G is a Stratix V GX-class Field Programmable Gate Array (FPGA) offered in an industrial temperature grade and delivered in a 1152-FBGA (35×35) package. It combines high logic capacity with substantial on-chip memory and a large I/O complement for dense, high-integration designs.

Typical uses target complex digital systems that require large programmable logic capacity, extensive embedded RAM, and broad I/O — for example, communications, high-performance signal processing, and industrial control systems. The device supports a low core supply voltage and an extended operating temperature range suitable for industrial deployments.

Key Features

• Logic Capacity  420,000 logic elements for implementing large-scale digital designs and complex system functions.
• Embedded Memory  Approximately 37.9 Mbits of embedded memory to support buffering, LUT-based storage, and data-intensive processing on-chip.
• I/O Count  552 available I/O pins to interface with wide buses, high-pin-count peripherals, and system I/O requirements.
• Package  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA (35x35)) optimized for high-density board-level integration.
• Power Supply  Core supply operating range from 820 mV to 880 mV to meet the device’s specified power requirements.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to accommodate industrial temperature environments.
• Mounting  Surface-mount device suited for modern PCB assembly and automated production flows.
• Compliance  RoHS compliant.

Typical Applications

• Networking & Communications  Use the device for packet processing, interface bridging, and protocol handling where high logic density and substantial on-chip memory enable flexible throughput architectures.
• High‑Performance Signal Processing  Implement DSP blocks, data path pipelines, and buffering with the device’s large logic fabric and embedded RAM.
• Industrial Control & Automation  Deploy in control systems requiring robust operation across −40 °C to 100 °C and extensive I/O connectivity for sensors and actuators.

Unique Advantages

• High logic density: 420,000 logic elements provide the headroom needed for complex, integrated FPGA designs without external glue logic.
• Substantial on‑chip memory: Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Large I/O footprint: 552 I/O pins support broad peripheral interfacing and parallel data paths, simplifying system-level routing.
• Industrial temperature support: Rated for −40 °C to 100 °C, making the device suitable for demanding environmental conditions.
• Compact, high-density package: 1152-FBGA (35×35) package enables high integration in space-constrained PCBs.
• RoHS compliant: Meets standard environmental compliance for lead-free assembly.

Why Choose 5SGXEA4H3F35I3G?

The 5SGXEA4H3F35I3G positions itself as a high-capacity Stratix V GX FPGA option for engineers building complex digital systems that require a combination of large programmable logic resources, significant embedded memory, and extensive I/O. Its industrial temperature rating and surface-mount FBGA packaging make it suitable for integrated products deployed in challenging environments.

This device is well suited for teams seeking a scalable, high-density FPGA substrate to consolidate functionality, reduce external components, and support sophisticated signal processing and communications tasks while operating within a defined core voltage envelope.

Request a quote or submit an inquiry for pricing and availability to proceed with design evaluation and procurement of the 5SGXEA4H3F35I3G.