5SGXEA4H3F35I3LG

The 5SGXEA4H3F35I3LG is an Intel Stratix® V GX field programmable gate array in a 1152‑ball FCBGA package. It delivers high-density programmable logic and on-chip memory for complex system designs requiring large logic capacity, significant embedded RAM, and a substantial I/O count.

Built for industrial temperature operation, this device targets applications that require robust logic and memory integration, broad I/O connectivity, and a compact surface‑mount package for board‑level deployment.

Key Features

• Logic Capacity  420,000 logic elements to implement large combinational and sequential logic designs.
• On‑Chip Memory  Approximately 38 Mbits of embedded memory for buffering, lookup tables, and data storage.
• I/O Resources  552 available I/Os to support extensive peripheral, bus, and parallel interface connectivity.
• Power Supply  Core voltage supply range from 820 mV to 880 mV, supporting the device’s core power requirements.
• Package & Mounting  1152‑BBGA (FCBGA) supplier package, 1152‑FBGA (35 × 35) footprint; surface‑mount device for PCB assembly.
• Operating Range & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C.
• Standards & Compliance  RoHS compliant.
• Stratix V Series Characteristics  The Stratix V family datasheet documents available core and transceiver speed grades and transceiver channel options for GX devices as part of the Stratix V device family specifications.

Typical Applications

• High‑density data processing  Implement complex signal processing pipelines or custom accelerators using the device’s large logic element count and embedded memory.
• Network and communications  Leverage the high I/O count for parallel interfaces and board‑level connectivity in networking equipment and protocol processing.
• Industrial control and automation  Use the industrial temperature rating and broad I/O to consolidate control, monitoring, and interface functions on a single FPGA.
• High‑performance prototyping  Deploy as a development platform for large FPGA designs requiring extensive logic and memory resources.

Unique Advantages

• Large programmable fabric: 420,000 logic elements reduce the need for multiple devices by accommodating complex designs in a single FPGA.
• Substantial embedded memory: Approximately 38 Mbits of on‑chip RAM enables local buffering and fast data storage without external memory in many use cases.
• High I/O density: 552 I/Os provide flexibility for multi‑lane interfaces, parallel buses, and mixed signal I/O arrangements.
• Industrial temperature capability: Rated from −40 °C to 100 °C for deployment in temperature‑sensitive industrial environments.
• Compact FCBGA packaging: 1152‑ball FCBGA in a 35 × 35 footprint supports board space optimization while maintaining high pin count.
• RoHS compliant: Meets RoHS requirements for restricted substances.

Why Choose 5SGXEA4H3F35I3LG?

This Stratix V GX device combines very large logic capacity, significant embedded memory, and a high I/O count in a single industrial‑grade FPGA package, making it suitable for system designs that demand dense integration and reliable operation across a wide temperature range. The device’s FCBGA footprint and surface‑mount mounting support compact board designs while preserving extensive board‑level connectivity.

Engineers designing complex data paths, protocol engines, or consolidated control systems will find this device well‑matched to applications where logic density, on‑chip memory, and I/O flexibility are primary selection drivers. As part of the Stratix V family, it aligns with the documented Stratix V device speed‑grade and transceiver options described in the family datasheet.

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