5SGXEA4H3F35I4
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,333 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXEA4H3F35I4 – Stratix® V GX FPGA, 420,000 Logic Elements, 1152-BBGA
The 5SGXEA4H3F35I4 is a Stratix V GX field-programmable gate array (FPGA) designed on a 28‑nm process. It combines a high-density logic fabric with large embedded memory and high-speed transceiver capability to address bandwidth‑centric and data‑intensive designs.
Targeted applications include optical transport, packet processing, traffic management, and high‑performance DSP tasks. The device pairs a redesigned adaptive logic architecture and rich on‑chip resources with industrial temperature grading for deployment in demanding environments.
Key Features
- Core & Fabric — 28‑nm device architecture with a redesigned adaptive logic module (ALM) and multi‑track routing and comprehensive fabric clocking network for scalable logic implementation.
- Logic Capacity — 158,500 adaptive logic modules (ALMs) supporting 420,000 logic elements for complex gateware and system logic integration.
- Embedded Memory — Approximately 37.9 Mbits of on‑chip RAM implemented with 20‑Kbit M20K memory blocks to support large buffering and state storage.
- DSP & IP Blocks — Variable precision DSP resources and Embedded HardCopy Block support for hardening IP such as PCIe Gen implementations and high‑precision signal processing.
- High‑Speed Transceivers & I/O — GX family capability includes integrated transceivers with up to 14.1 Gbps data rate and a device I/O count of 552 to support high‑bandwidth interfaces.
- Power & Voltage — Core supply range specified at 820 mV to 880 mV to match system power domains and optimize performance.
- Package & Mounting — 1152‑BBGA (FCBGA) package, supplier device package 1152‑FBGA (35×35), designed for surface‑mount assembly.
- Environmental & Temperature — Industrial grade operation with an operating temperature range of −40 °C to 100 °C; RoHS compliant.
- Clocking & PLLs — Fabric includes fractional phase‑locked loops (PLLs) for flexible clock synthesis and distribution.
Typical Applications
- 40G/100G Optical Transport: Ideal for high‑bandwidth line cards and optical interface processing where integrated transceivers and large buffering are required.
- Packet Processing & Network Switching: Implements traffic management, packet inspection, and custom forwarding logic using the device’s high logic capacity and I/O count.
- Network Test & Measurement: Provides the programmable performance and precision timing needed for test instrumentation and protocol analysis.
- High‑Performance DSP Systems: Supports compute‑intensive signal processing with variable precision DSP blocks and significant on‑chip RAM for intermediate data storage.
Unique Advantages
- High Logic Density: 420,000 logic elements enable large, integrated designs without partitioning across multiple devices.
- Integrated High‑Speed Connectivity: GX transceiver capability and 552 I/Os reduce external transceiver components and simplify high‑bandwidth interface design.
- Substantial On‑Chip Memory: Approximately 37.9 Mbits of embedded RAM supports deep buffering and stateful processing close to logic to improve throughput and latency.
- Industrial Temperature Rating: −40 °C to 100 °C operation allows deployment in industrial and rugged environments.
- Programmable Hard IP Support: Embedded HardCopy Block and PLLs streamline implementation of common high‑performance interfaces and clocking schemes.
- Compact, Surface‑Mount Package: 1152‑BBGA FCBGA (35×35) package balances I/O density with a footprint suitable for high‑density system boards.
Why Choose 5SGXEA4H3F35I4?
The 5SGXEA4H3F35I4 delivers a balance of high logic capacity, sizable embedded memory, and GX transceiver capability in an industrial‑rated Stratix V FPGA. It is well suited for designers building bandwidth‑focused and data‑intensive systems that require programmable high‑speed interfaces, extensive on‑chip resources, and robust thermal margins.
For engineering teams seeking a scalable FPGA platform with integrated hard IP options and flexible clocking, this device offers a clear path to implement complex signal processing, networking, and transport functions while keeping system integration streamlined.
Request a quote or submit an inquiry to receive pricing and availability information for 5SGXEA4H3F35I4.

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