5SGXEA4H3F35I4

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 37888000 420000 1152-BBGA, FCBGA

Quantity 1,333 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXEA4H3F35I4 – Stratix® V GX FPGA, 420,000 Logic Elements, 1152-BBGA

The 5SGXEA4H3F35I4 is a Stratix V GX field-programmable gate array (FPGA) designed on a 28‑nm process. It combines a high-density logic fabric with large embedded memory and high-speed transceiver capability to address bandwidth‑centric and data‑intensive designs.

Targeted applications include optical transport, packet processing, traffic management, and high‑performance DSP tasks. The device pairs a redesigned adaptive logic architecture and rich on‑chip resources with industrial temperature grading for deployment in demanding environments.

Key Features

  • Core & Fabric — 28‑nm device architecture with a redesigned adaptive logic module (ALM) and multi‑track routing and comprehensive fabric clocking network for scalable logic implementation.
  • Logic Capacity — 158,500 adaptive logic modules (ALMs) supporting 420,000 logic elements for complex gateware and system logic integration.
  • Embedded Memory — Approximately 37.9 Mbits of on‑chip RAM implemented with 20‑Kbit M20K memory blocks to support large buffering and state storage.
  • DSP & IP Blocks — Variable precision DSP resources and Embedded HardCopy Block support for hardening IP such as PCIe Gen implementations and high‑precision signal processing.
  • High‑Speed Transceivers & I/O — GX family capability includes integrated transceivers with up to 14.1 Gbps data rate and a device I/O count of 552 to support high‑bandwidth interfaces.
  • Power & Voltage — Core supply range specified at 820 mV to 880 mV to match system power domains and optimize performance.
  • Package & Mounting — 1152‑BBGA (FCBGA) package, supplier device package 1152‑FBGA (35×35), designed for surface‑mount assembly.
  • Environmental & Temperature — Industrial grade operation with an operating temperature range of −40 °C to 100 °C; RoHS compliant.
  • Clocking & PLLs — Fabric includes fractional phase‑locked loops (PLLs) for flexible clock synthesis and distribution.

Typical Applications

  • 40G/100G Optical Transport: Ideal for high‑bandwidth line cards and optical interface processing where integrated transceivers and large buffering are required.
  • Packet Processing & Network Switching: Implements traffic management, packet inspection, and custom forwarding logic using the device’s high logic capacity and I/O count.
  • Network Test & Measurement: Provides the programmable performance and precision timing needed for test instrumentation and protocol analysis.
  • High‑Performance DSP Systems: Supports compute‑intensive signal processing with variable precision DSP blocks and significant on‑chip RAM for intermediate data storage.

Unique Advantages

  • High Logic Density: 420,000 logic elements enable large, integrated designs without partitioning across multiple devices.
  • Integrated High‑Speed Connectivity: GX transceiver capability and 552 I/Os reduce external transceiver components and simplify high‑bandwidth interface design.
  • Substantial On‑Chip Memory: Approximately 37.9 Mbits of embedded RAM supports deep buffering and stateful processing close to logic to improve throughput and latency.
  • Industrial Temperature Rating: −40 °C to 100 °C operation allows deployment in industrial and rugged environments.
  • Programmable Hard IP Support: Embedded HardCopy Block and PLLs streamline implementation of common high‑performance interfaces and clocking schemes.
  • Compact, Surface‑Mount Package: 1152‑BBGA FCBGA (35×35) package balances I/O density with a footprint suitable for high‑density system boards.

Why Choose 5SGXEA4H3F35I4?

The 5SGXEA4H3F35I4 delivers a balance of high logic capacity, sizable embedded memory, and GX transceiver capability in an industrial‑rated Stratix V FPGA. It is well suited for designers building bandwidth‑focused and data‑intensive systems that require programmable high‑speed interfaces, extensive on‑chip resources, and robust thermal margins.

For engineering teams seeking a scalable FPGA platform with integrated hard IP options and flexible clocking, this device offers a clear path to implement complex signal processing, networking, and transport functions while keeping system integration streamlined.

Request a quote or submit an inquiry to receive pricing and availability information for 5SGXEA4H3F35I4.

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