5SGXEA4K1F35C1N

The 5SGXEA4K1F35C1N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a 1152-BBGA / FCBGA package. It delivers a high-density programmable fabric with 420,000 logic elements and approximately 38 Mbits of embedded memory, together with 432 general-purpose I/Os.

Designed for commercial-temperature applications, this surface-mount device operates with a core supply range of 870 mV to 930 mV and an ambient operating temperature range of 0 °C to 85 °C. The Stratix V family datasheet describes high-performance electrical and transceiver characteristics available across the GX product line.

Key Features

• Large Logic Capacity — 420,000 logic elements to implement complex custom logic, hardware acceleration, and large-scale finite-state machines.
• Embedded Memory — Approximately 38 Mbits of on-chip RAM for buffering, FIFOs, and on-device data storage.
• High I/O Count — 432 I/Os to support wide parallel interfaces, multi-channel connectivity, and dense board-level interconnects.
• Package and Mounting — 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA (35x35)) in a surface-mount form factor for board-level integration.
• Power and Supply — Core voltage supply range of 870 mV to 930 mV to match low-voltage system rails.
• Commercial Grade — Rated for commercial temperature operation from 0 °C to 85 °C.
• Standards Compliance — RoHS compliant.

Typical Applications

• Custom Hardware Acceleration — Implement compute- or control-intensive functions using the large logic and memory resources.
• High‑density I/O Systems — Bridge, aggregate, or manage many parallel interfaces with the device’s 432 I/Os.
• Protocol and Data Path Processing — Build complex packet, data-path, or protocol logic using abundant logic elements and embedded RAM.
• Prototyping and System Integration — Integrate large designs and validate system-level behavior on a high-capacity FPGA platform.

Unique Advantages

• Large programmable fabric: 420,000 logic elements enable implementation of extensive logic networks without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 38 Mbits of embedded RAM reduces dependence on external memory for many buffering and scratchpad needs.
• Extensive I/O resources: 432 I/Os provide flexibility for dense interface mappings and complex board-level connectivity.
• Compact, manufacturable package: 1152-ball FCBGA package in a surface-mount form factor supports standard PCB assembly workflows.
• Commercial temperature rating: Qualified for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic systems.
• Low-voltage core support: Core supply range of 870 mV to 930 mV aligns with modern low-voltage power architectures.

Why Choose 5SGXEA4K1F35C1N?

The 5SGXEA4K1F35C1N brings together high logic density, significant embedded memory, and a large I/O complement in a 1152-ball FCBGA package—making it suitable for complex commercial designs that require sizable on-chip resources. As a member of the Stratix V GX family, it benefits from the series’ documented electrical and transceiver capabilities described in the device datasheet.

Choose this FPGA when your design demands extensive programmable logic, substantial on-chip RAM, and broad I/O connectivity within a surface-mount, RoHS-compliant package for commercial-temperature operation.

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