5SGXEA4K1F35C2G

The 5SGXEA4K1F35C2G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel designed for applications that require a large programmable fabric, substantial embedded memory, and a high I/O count. The device features 420,000 logic elements, approximately 37.9 Mbits of on‑chip RAM, and 432 user I/Os in a 1152‑BBGA (35×35 FCBGA) surface‑mount package.

It is a commercial‑grade device with an operating temperature range of 0 °C to 85 °C and a core voltage supply range of 870 mV to 930 mV. As part of the Stratix V GX family, the device benefits from the series’ transceiver speed grade options and family‑level electrical characterization provided in the Stratix V device documentation.

Key Features

• Programmable Fabric  420,000 logic elements provide large-scale logic capacity for complex digital designs and algorithm implementation.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM supports data buffering, LUT RAM, FIFOs, and other memory‑intensive functions.
• High I/O Count  432 general purpose I/Os accommodate broad interfacing requirements for parallel buses, control signals, and external peripherals.
• Package and Mounting  1152‑BBGA (FCBGA) 35×35 supplier package in a surface‑mount form factor for compact system integration.
• Power and Operating Range  Core supply specified from 870 mV to 930 mV and commercial temperature grade rated for 0 °C to 85 °C operation.
• Stratix V GX Family Transceiver Options  The Stratix V GX family provides transceiver speed grade options (documented up to 14.1 Gbps per GX channel in family literature), enabling high‑speed serial link configurations where applicable.
• RoHS Compliant  Device meets RoHS requirements as specified by the supplier.

Typical Applications

• High‑density digital processing  Large logic capacity and substantial embedded RAM make this device suitable for implementing complex state machines, data path processing, and custom accelerators.
• High‑I/O system interfaces  432 I/Os support designs with extensive parallel interfaces, multiple peripheral buses, and board‑level control functions.
• Memory‑intensive designs  Approximately 37.9 Mbits of on‑chip RAM supports buffering, packet handling, and on‑chip data storage for real‑time processing tasks.
• Compact system integration  1152‑BBGA (35×35 FCBGA) surface‑mount package enables high‑density board layouts and compact module designs.

Unique Advantages

• Large programmable capacity: 420,000 logic elements let you consolidate complex functionality into a single FPGA, reducing component count and board complexity.
• Significant embedded memory: Approximately 37.9 Mbits of on‑chip RAM lowers dependence on external memory for many buffering and storage tasks.
• High I/O flexibility: 432 I/Os provide flexible routing for diverse interface requirements without immediate need for external I/O expanders.
• Family transceiver support: As a Stratix V GX device, it is part of a family that includes high‑speed transceiver options documented in the device series literature.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation, aligning with standard commercial electronics deployments.

Why Choose 5SGXEA4K1F35C2G?

The 5SGXEA4K1F35C2G combines a large programmable fabric, substantial embedded RAM, and a high I/O count in a compact 1152‑BBGA surface‑mount package, making it a practical choice for systems that require concentrated logic resources and on‑chip memory. Its commercial temperature rating and specified core voltage range provide clear electrical and environmental boundaries for design planning.

This device is suitable for designers targeting high‑capacity programmable implementations who need predictable device specifications and family‑level transceiver options documented in the Stratix V GX literature. Its integration density and feature set support scalable designs where consolidating logic and memory can reduce board area and simplify system architectures.

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