5SGXEA4K1F35C2N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 37888000 420000 1152-BBGA, FCBGA

Quantity 215 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXEA4K1F35C2N – Stratix® V GX Field Programmable Gate Array (FPGA) IC, 420,000 Logic Element Cells, 1152-BBGA

The 5SGXEA4K1F35C2N is a Stratix® V GX family FPGA from Intel, delivered in a 1152-ball FCBGA package and rated for commercial temperature operation. It combines high logic capacity, substantial on-chip RAM, and a large I/O count to address demanding digital signal processing, protocol offload, and high-density integration tasks.

Designed for applications that require large programmable logic resources and extensive I/O, this device offers a balance of integration and electrical flexibility with a core supply voltage range of 870 mV to 930 mV and RoHS compliance.

Key Features

  • Core Logic Capacity  Provides 420,000 logic element cells and 158,500 logic elements for complex logic implementations and large-scale designs.
  • Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data structures without external memory.
  • I/O Density  432 user I/O pins to enable broad peripheral connectivity and high-bandwidth external interfaces.
  • Package & Mounting  Supplied in a 1152-BBGA (FCBGA) package—supplier device package: 1152-FBGA (35×35)—designed for surface-mount PCB assembly.
  • Power  Core voltage supply range specified at 870 mV to 930 mV to meet system-level power budgeting and regulator design constraints.
  • Operating Temperature (Commercial)  Specified for 0 °C to 85 °C operation suitable for commercial-grade applications.
  • Regulatory  RoHS compliant for ease of integration into compliant product lines.
  • Stratix V GX Family Characteristics (series-level)  As part of the Stratix V GX family, the device is covered by the Stratix V device datasheet which documents available transceiver speed grades and electrical/switching characteristics for the family.

Typical Applications

  • Telecommunications & High-speed Networking  Family-level Stratix V GX transceiver offerings and the device's high logic and I/O density make it suitable for protocol processing, packet handling, and line-rate functions.
  • Data Center Acceleration  Large logic capacity and substantial on-chip RAM support custom acceleration tasks and offload engines in compute-dense environments.
  • Video and Imaging Processing  High logic and memory resources enable pipeline implementations for real-time video processing and multi-channel imaging applications.
  • Test, Measurement & Instrumentation  Extensive I/O and programmable logic resources allow complex measurement, signal conditioning, and custom instrument functions.
  • Platform and Algorithm Prototyping  Rich logic and memory resources provide headroom for prototyping complex algorithms and system prototypes on a commercial-grade FPGA platform.

Unique Advantages

  • High Logic Density: 420,000 logic element cells and 158,500 logic elements enable integration of large logic functions on a single device, reducing system BOM and board count.
  • Substantial On-Chip Memory: Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate storage.
  • Large I/O Count: 432 I/Os provide flexibility for multi-channel interfaces, parallel buses, and mixed-signal front-ends.
  • Compact FCBGA Packaging: 1152-ball FCBGA (35×35) package supports high-density PCB designs while maintaining surface-mount assembly compatibility.
  • Commercial Temperature Rating: Specified operation from 0 °C to 85 °C for deployments in commercial environments.
  • Standards-Ready Compliance: RoHS compliance simplifies integration into products targeting regulatory conformance.

Why Choose 5SGXEA4K1F35C2N?

The 5SGXEA4K1F35C2N delivers a high-capacity, commercially rated Stratix V GX FPGA in a dense FCBGA package, suitable for engineers who need substantial programmable logic, significant on-chip RAM, and broad I/O. Its specified supply voltage range and commercial temperature rating make it straightforward to design into power- and temperature-controlled systems.

Backed by the Stratix V device documentation, this device is appropriate for development and deployment where integration, logic density, and on-chip memory are primary requirements. It offers a platform-level option for designers focused on protocol processing, compute acceleration, and real-time signal processing in commercial environments.

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