5SGXEA4K1F35I2N

The 5SGXEA4K1F35I2N is a Stratix® V GX field‑programmable gate array (FPGA) delivering high logic density and extensive I/O capability in a 1152‑FBGA (35 × 35 mm) package. Designed and specified as an industrial‑grade device, it combines substantial embedded memory and a wide operating temperature range for demanding electronic systems.

With 420,000 logic elements, approximately 38 Mbits of on‑chip RAM and 432 I/O pins, this device targets systems that require programmable logic density, broad connectivity and robust operation across –40 °C to 100 °C. The device operates from a core supply in the 870 mV to 930 mV range and is RoHS compliant.

Key Features

• High logic density — 420,000 logic elements to implement complex programmable logic, custom datapaths and large designs.
• Embedded memory — approximately 38 Mbits of on‑chip RAM to support buffering, FIFOs and local data storage without external memory.
• I/O capacity — 432 user I/Os for broad peripheral interfacing, parallel buses and multi‑lane connectivity.
• Industrial operating range — specified for –40 °C to 100 °C to meet the thermal requirements of industrial and ruggedized applications.
• Power supply — core voltage range of 870 mV to 930 mV, enabling predictable power planning for system integrators.
• Package and mounting — 1152‑BBGA/FCBGA package (supplier package: 1152‑FBGA, 35 × 35 mm) in a surface‑mount form factor for high‑density PCB designs.
• Compliance — RoHS compliant, supporting regulatory requirements for restricted substances.

Typical Applications

• Industrial control and automation — leverage the industrial temperature range and high logic density for control, sequencing and real‑time processing in factory or process environments.
• High‑performance data processing — use the large pool of logic elements and embedded RAM to implement custom datapaths, packet processing and hardware accelerators.
• Board‑level bridging and I/O aggregation — 432 I/Os enable complex bus bridging, protocol conversion and multi‑channel I/O aggregation on a single device.
• Rugged embedded systems — surface‑mount 1152‑FBGA package and wide operating temperature make the device suitable for compact, robust embedded assemblies.

Unique Advantages

• Large programmable fabric — 420,000 logic elements provide the capacity to integrate multiple subsystems into a single FPGA, reducing board complexity.
• Substantial on‑chip memory — approximately 38 Mbits of embedded RAM minimizes the need for external memory in many buffering and caching use cases.
• Extensive I/O — 432 I/Os simplify connectivity to processors, sensors, network PHYs and legacy peripherals without additional multiplexing logic.
• Industrial‑grade reliability — rated for operation from –40 °C to 100 °C, enabling deployment in harsh temperature environments.
• Compact, high‑density package — 1152‑FBGA (35 × 35 mm) surface‑mount package balances pin count and PCB area for advanced system designs.
• Regulatory friendliness — RoHS compliance supports environmentally restricted applications and supplier selection criteria.

Why Choose 5SGXEA4K1F35I2N?

The 5SGXEA4K1F35I2N is positioned for designs that demand significant programmable logic, plentiful on‑chip memory and large I/O capability within an industrial temperature envelope. Its combination of 420,000 logic elements, approximately 38 Mbits of embedded RAM and 432 I/Os enables consolidation of complex functions onto a single FPGA, helping reduce system BOM and board area.

Engineers designing data‑intensive, I/O‑rich or industrial systems will find this Stratix V GX device well suited to scalable, robust implementations where predictable power supply and package density matter. The device’s specifications support long‑term deployment scenarios and integration into professional engineering workflows.

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