5SGXEA4K1F40C2L

IC FPGA 696 I/O 1517FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 37888000 420000 1517-BBGA, FCBGA

Quantity 56 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1517-FBGA (40x40)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXEA4K1F40C2L – Stratix® V GX Field Programmable Gate Array (FPGA), 420,000 Logic Elements, 696 I/Os

The 5SGXEA4K1F40C2L is a Stratix® V GX field programmable gate array (FPGA) IC from Intel designed for high-density, commercially graded programmable logic applications. It delivers a large logic fabric and substantial on-chip memory to support complex, I/O-intensive designs.

This device is supplied in a high-pin-count BGA package and operates within a commercial temperature range, providing a balance of performance, integration, and manufacturability for demanding board-level designs.

Key Features

  • Core Logic — 420,000 logic elements are available for implementing complex digital functions; the device lists 158,500 LABs/CLBs for logic organization.
  • Embedded Memory — Approximately 37.9 Mbits of on-chip RAM (37,888,000 total RAM bits) for buffering, FIFOs, and state storage without external memory.
  • I/O Capacity — 696 device I/Os to support dense peripheral and interface connections on high-channel-count designs.
  • Power Supply — Core voltage supply range documented at 820 mV to 880 mV to match platform power design requirements.
  • Package & Mounting — 1517-BBGA (FCBGA) package; supplier device package listed as 1517-FBGA (40×40). Surface-mount construction for standard PCB assembly.
  • Operating Conditions — Commercial grade device rated for 0 °C to 85 °C operating temperature.
  • Environmental Compliance — RoHS compliant to support lead-free manufacturing processes.

Unique Advantages

  • High logic density: 420,000 logic elements allow implementation of large, integrated digital systems on a single FPGA, reducing external components.
  • Significant on-chip memory: Approximately 37.9 Mbits of embedded RAM enables substantial buffering and data-path storage without immediate reliance on off-chip memory.
  • Extensive I/O count: 696 I/Os accommodate complex, multi-channel interfaces and high-pin-count connectivity requirements.
  • Compact high-pin-count package: The 1517-BBGA (1517-FBGA, 40×40) footprint provides a dense pinout in a surface-mount BGA form factor suited for modern PCB layouts.
  • Commercial temperature rating: Rated 0 °C to 85 °C to match typical commercial deployment environments and system thermal designs.
  • RoHS compliance: Facilitates lead-free assembly and adherence to common environmental manufacturing standards.

Why Choose 5SGXEA4K1F40C2L?

The 5SGXEA4K1F40C2L combines a large logic resource pool, substantial embedded memory, and a high I/O count in a single commercial-grade Stratix V GX FPGA package. Its documented electrical and package characteristics make it suitable for high-density, I/O-heavy designs where on-chip integration and compact board-level implementation are priorities.

Backed by Intel’s Stratix V family documentation, this device is positioned for engineers and procurement teams seeking a verified, high-capacity FPGA building block for commercial applications that require extensive logic, memory, and I/O integration.

Request a quote or submit an inquiry for part number 5SGXEA4K1F40C2L to receive pricing, availability, and ordering information.

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