5SGXEA4K1F35C2LG

The 5SGXEA4K1F35C2LG is an Intel Stratix V GX field programmable gate array (FPGA) offered in a commercial temperature grade. This device provides a large logic fabric, substantial on‑chip memory capacity, and a high I/O count in a surface‑mount FCBGA package.

Engineered for designs that require significant programmable logic and dense I/O, the device combines 420,000 logic elements with approximately 37.888 Mbits of embedded memory and 432 dedicated I/O pins, enabling complex system integration in a single FPGA footprint.

Key Features

• Logic Capacity  420,000 logic elements (cells) for implementing complex custom logic, state machines, and datapaths.
• Embedded Memory  Approximately 37.888 Mbits of on‑chip RAM to support large buffers, FIFOs, and memory‑based functions without external RAM.
• I/O Count  432 programmable I/O pins to interface with multiple peripherals, buses, and external components.
• Package and Mounting  1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35). Surface mount mounting type suitable for modern PCB assembly processes.
• Power  Core voltage supply range of 820 mV to 880 mV, supporting the device’s specified operating conditions.
• Temperature Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards  RoHS compliant.

Typical Applications

• High‑density logic integration  Large FPGA logic capacity makes the device suitable for designs that consolidate multiple functions into a single programmable device.
• On‑chip memory‑centric designs  Approximately 37.888 Mbits of embedded RAM enables implementations that require substantial internal buffering or memory resources.
• High‑pin‑count system interfaces  With 432 I/O pins and a dense FCBGA package, the part fits applications needing extensive external connectivity and parallel interfaces.

Unique Advantages

• Large programmable fabric: 420,000 logic elements provide headroom for complex logic, custom accelerators, and multi‑function systems on a single device.
• Significant on‑chip memory: Approximately 37.888 Mbits of embedded RAM reduces reliance on external memory and simplifies board-level design.
• High I/O density: 432 I/Os support broad system connectivity and multiple parallel interfaces without additional I/O expanders.
• Dense FCBGA package: 1152‑BBGA / 1152‑FBGA (35×35) package balances pin count and PCB area for high‑performance board designs.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation for general commercial applications.
• Regulatory compliance: RoHS compliance aligns with common environmental and manufacturing requirements.

Why Choose 5SGXEA4K1F35C2LG?

The 5SGXEA4K1F35C2LG is positioned for designs that demand a combination of substantial logic resources, considerable on‑chip RAM, and a high number of I/Os in a dense surface‑mount package. Its commercial temperature grade and RoHS compliance make it suitable for mainstream electronic products and development platforms that leverage the Stratix V GX family’s capabilities.

Selecting this FPGA can reduce system complexity by integrating large amounts of logic and memory into a single device while preserving extensive external connectivity. The combination of 420,000 logic elements, approximately 37.888 Mbits of embedded memory, and 432 I/Os provides a strong foundation for scalable, robust designs supported by the Stratix V family documentation.

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