5SGXEA4K1F35C1G

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 37888000 420000 1152-BBGA, FCBGA

Quantity 142 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXEA4K1F35C1G – Stratix® V GX FPGA, 432 I/Os, ~37.9 Mbits RAM, 420k logic elements

The 5SGXEA4K1F35C1G is a Stratix® V GX field programmable gate array (FPGA) IC from Intel designed for high-density programmable logic applications. This commercial-grade, surface-mount device integrates approximately 420,000 logic elements and roughly 37.9 Mbits of on-chip RAM to support complex datapath, control and acceleration tasks.

With 432 user I/O pins and a 1152-ball BGA package (1152-FBGA, 35×35), this device targets systems that require large I/O capacity, substantial embedded memory and high logic density within a compact surface-mount footprint. It operates over a 0 °C to 85 °C temperature range and a core voltage supply range of 870 mV to 930 mV.

Key Features

  • Logic Capacity  Approximately 420,000 logic elements to implement large-scale custom logic, control, and datapath functions.
  • Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support packet buffers, frame storage, lookup tables and other memory-intensive functions.
  • I/O Density  432 general-purpose I/O pins for broad interfacing options to high-pin-count systems and mezzanine modules.
  • Package & Mounting  1152-ball BGA package (1152-FBGA, 35×35) with surface-mount mounting for high pin-count board integration and reliable soldered connections.
  • Power  Core supply voltage range from 870 mV to 930 mV to match system power-rail planning and core power sequencing.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for mainstream commercial and enterprise electronics.
  • Regulatory  RoHS compliant, meeting common environmental and material requirements for electronic assemblies.

Typical Applications

  • High-performance networking  Implements packet processing, traffic shaping and protocol offload in switches and routers where high logic density and many I/Os are required.
  • Data acceleration and compute  Serves as a programmable accelerator for compute-heavy functions, leveraging large logic capacity and embedded RAM for buffering and custom pipelines.
  • Video and imaging systems  Supports video processing, real-time frame buffering and format conversion using abundant logic resources and on-chip memory.
  • Test, measurement and instrumentation  Provides flexible, high-pin-count FPGA resources for signal acquisition, preprocessing and custom measurement logic.

Unique Advantages

  • High integration density: Large logic element count and significant embedded memory reduce board-level component count and simplify system architecture.
  • Substantial I/O capability: 432 I/Os enable direct interfacing to multiple peripherals, sensors, and high-speed connectors without external I/O expanders.
  • Compact BGA package: 1152-ball FBGA (35×35) delivers high pin count in a compact surface-mount form factor for space-constrained designs.
  • Commercial operating range: Specified 0 °C to 85 °C operation for reliable deployment in mainstream commercial and enterprise environments.
  • Controlled core supply window: Defined 870 mV–930 mV core voltage range aids power budgeting and integration with modern power management solutions.
  • RoHS compliant: Meets current material compliance expectations for modern electronics manufacturing.

Why Choose 5SGXEA4K1F35C1G?

The 5SGXEA4K1F35C1G positions itself as a high-density, high-I/O Stratix V GX FPGA ideal for designers who need large programmable logic capacity, substantial on-chip RAM and broad interfacing in a single, surface-mount package. Its combination of approximately 420k logic elements, ~37.9 Mbits of embedded memory and 432 I/Os makes it well suited to demanding commercial applications such as network processing, data acceleration, video processing and test systems.

Backed by the Stratix V device family documentation, this part provides the scalability and integration needed for complex system designs while conforming to commercial temperature and RoHS requirements for mainstream deployment.

Request a quote or submit an RFQ to get pricing and availability for the 5SGXEA4K1F35C1G and to discuss how this Stratix V GX FPGA can fit into your next design.

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