5SGXEA4K1F35C1G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 37888000 420000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 142 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 158500 | Number of Logic Elements/Cells | 420000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 37888000 |
Overview of 5SGXEA4K1F35C1G – Stratix® V GX FPGA, 432 I/Os, ~37.9 Mbits RAM, 420k logic elements
The 5SGXEA4K1F35C1G is a Stratix® V GX field programmable gate array (FPGA) IC from Intel designed for high-density programmable logic applications. This commercial-grade, surface-mount device integrates approximately 420,000 logic elements and roughly 37.9 Mbits of on-chip RAM to support complex datapath, control and acceleration tasks.
With 432 user I/O pins and a 1152-ball BGA package (1152-FBGA, 35×35), this device targets systems that require large I/O capacity, substantial embedded memory and high logic density within a compact surface-mount footprint. It operates over a 0 °C to 85 °C temperature range and a core voltage supply range of 870 mV to 930 mV.
Key Features
- Logic Capacity Approximately 420,000 logic elements to implement large-scale custom logic, control, and datapath functions.
- Embedded Memory Approximately 37.9 Mbits of on-chip RAM to support packet buffers, frame storage, lookup tables and other memory-intensive functions.
- I/O Density 432 general-purpose I/O pins for broad interfacing options to high-pin-count systems and mezzanine modules.
- Package & Mounting 1152-ball BGA package (1152-FBGA, 35×35) with surface-mount mounting for high pin-count board integration and reliable soldered connections.
- Power Core supply voltage range from 870 mV to 930 mV to match system power-rail planning and core power sequencing.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for mainstream commercial and enterprise electronics.
- Regulatory RoHS compliant, meeting common environmental and material requirements for electronic assemblies.
Typical Applications
- High-performance networking Implements packet processing, traffic shaping and protocol offload in switches and routers where high logic density and many I/Os are required.
- Data acceleration and compute Serves as a programmable accelerator for compute-heavy functions, leveraging large logic capacity and embedded RAM for buffering and custom pipelines.
- Video and imaging systems Supports video processing, real-time frame buffering and format conversion using abundant logic resources and on-chip memory.
- Test, measurement and instrumentation Provides flexible, high-pin-count FPGA resources for signal acquisition, preprocessing and custom measurement logic.
Unique Advantages
- High integration density: Large logic element count and significant embedded memory reduce board-level component count and simplify system architecture.
- Substantial I/O capability: 432 I/Os enable direct interfacing to multiple peripherals, sensors, and high-speed connectors without external I/O expanders.
- Compact BGA package: 1152-ball FBGA (35×35) delivers high pin count in a compact surface-mount form factor for space-constrained designs.
- Commercial operating range: Specified 0 °C to 85 °C operation for reliable deployment in mainstream commercial and enterprise environments.
- Controlled core supply window: Defined 870 mV–930 mV core voltage range aids power budgeting and integration with modern power management solutions.
- RoHS compliant: Meets current material compliance expectations for modern electronics manufacturing.
Why Choose 5SGXEA4K1F35C1G?
The 5SGXEA4K1F35C1G positions itself as a high-density, high-I/O Stratix V GX FPGA ideal for designers who need large programmable logic capacity, substantial on-chip RAM and broad interfacing in a single, surface-mount package. Its combination of approximately 420k logic elements, ~37.9 Mbits of embedded memory and 432 I/Os makes it well suited to demanding commercial applications such as network processing, data acceleration, video processing and test systems.
Backed by the Stratix V device family documentation, this part provides the scalability and integration needed for complex system designs while conforming to commercial temperature and RoHS requirements for mainstream deployment.
Request a quote or submit an RFQ to get pricing and availability for the 5SGXEA4K1F35C1G and to discuss how this Stratix V GX FPGA can fit into your next design.

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