5SGXEA4H3F35I4N

The 5SGXEA4H3F35I4N is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, offered in an industrial grade configuration. It provides high logic density and extensive on-chip memory in a compact ball-grid array package suitable for surface-mount assembly.

Designed for applications that require large programmable logic capacity, significant embedded RAM and a high I/O count, this device delivers a combination of integration and thermal range that supports industrial operating environments.

Key Features

• Core Logic Capacity  Provides 420,000 logic elements for implementing complex, high-density programmable logic designs.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM (37,888,000 bits) to support large buffers, FIFOs and local data storage.
• I/O Resources  Up to 552 device I/O pins to support extensive peripheral interfacing and multi-channel connectivity.
• Power and Voltage  Core supply operating range from 0.820 V to 0.880 V to meet specified device power requirements.
• Package & Mounting  1152-FBGA (35×35) / 1152-BBGA, FCBGA package, designed for surface-mount PCB assembly.
• Industrial Temperature Range  Specified operating temperature from −40 °C to 100 °C, aligned with industrial-grade deployment needs.
• Compliance  RoHS-compliant construction for environmental conformity.

Typical Applications

• Industrial Control Systems  Suitable for programmable logic in industrial equipment where extended operating temperature and industrial grade components are required.
• High-density Signal Processing  Large logic capacity and substantial embedded RAM make this device appropriate for complex DSP, filtering and real-time processing tasks.
• Communications and I/O Aggregation  High I/O count supports applications that require extensive interface connections and board-level aggregation.
• Prototyping and System Integration  Provides a highly programmable platform for system architects needing large available logic and memory resources in a single device.

Unique Advantages

• Highly integrated logic capacity: 420,000 logic elements reduce the need for multiple devices in dense designs.
• Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM supports large local buffering and state storage without external memory.
• Extensive I/O availability: 552 I/Os enable broad peripheral support and high-channel-count interfaces from one FPGA.
• Industrial-rated operation: −40 °C to 100 °C operating range and industrial grade specification support robust deployment in harsh environments.
• Compact BGA package: 1152-FBGA (35×35) package offers a compact footprint for high-density PCB layouts and surface-mount manufacturing.
• Controlled core voltage range: 0.820 V–0.880 V core supply range provides defined power-envelope characteristics for system power budgeting.

Why Choose 5SGXEA4H3F35I4N?

The 5SGXEA4H3F35I4N positions itself as a high-density, industrial-grade FPGA option from Intel’s Stratix V GX family, combining 420,000 logic elements, nearly 38 Mbits of embedded RAM and 552 I/Os in a compact 1152-FBGA package. Its specified core-voltage range and industrial operating temperature make it suitable for designs that require both significant programmable capacity and robust environmental tolerance.

This device is well suited to engineers and system designers who need a single, integrated FPGA to consolidate logic, memory and I/O in demanding applications—offering scalability, board-level integration and supplier continuity from Intel.

Request a quote or submit an inquiry to obtain pricing and availability for 5SGXEA4H3F35I4N.