5SGXEA4H3F35C4G

The 5SGXEA4H3F35C4G is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1152‑ball BGA (FCBGA) package. It delivers large logic and on‑chip memory resources with a high I/O count for demanding commercial embedded applications.

Key on‑chip resources include 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and 552 user I/Os. The device is offered in a 1152‑FBGA (35×35) supplier package, is RoHS compliant, and is rated for commercial temperature operation (0 °C to 85 °C).

Key Features

• Core Logic  420,000 logic elements support complex digital designs and dense logic integration.
• Logic Array Blocks  Approximately 158,500 logic array blocks provide a scalable fabric for partitioned and hierarchical design flows.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM for buffers, FIFOs, and local data storage.
• High I/O Count  552 user I/Os enable broad connectivity to peripherals, memory interfaces, and high‑pin count daughtercards.
• Package & Mounting  1152‑BBGA (FCBGA) surface‑mount package; supplier device package listed as 1152‑FBGA (35×35) for dense board integration.
• Power and Supply  Device core supply specified between 820 mV and 880 mV to support expected operating conditions.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
• RoHS Compliant  Meets RoHS environmental requirements.

Typical Applications

• High‑density digital processing  Use the large logic fabric and embedded RAM for complex control, signal processing, or packet processing pipelines.
• Connectivity hubs and protocol bridging  552 I/Os enable dense interface implementations between multiple external devices and subsystems.
• Prototyping and system development  Large resource counts make this device suitable for board‑level prototyping of systems that require significant programmable logic and memory.

Unique Advantages

• Substantial logic capacity: 420,000 logic elements provide headroom for large state machines, datapaths, and custom accelerators.
• Significant on‑chip memory: Approximately 37.9 Mbits of embedded RAM reduces external memory dependency for many buffering and caching needs.
• Extensive I/O resources: 552 I/Os support multiple high‑pin interfaces without immediate need for I/O expanders.
• Compact, high‑pin package: 1152‑BBGA (35×35) package enables dense board routing while keeping the solution surface‑mount friendly.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial deployments and development environments.
• Regulatory readiness: RoHS compliance supports environmentally conscious product designs and supply chain requirements.

Why Choose 5SGXEA4H3F35C4G?

The 5SGXEA4H3F35C4G positions itself as a high‑capacity, commercial‑grade Stratix V GX FPGA offering large programmable logic, abundant embedded memory, and extensive I/O in a 1152‑ball BGA package. Its combination of 420,000 logic elements, approximately 37.9 Mbits of on‑chip RAM, and 552 I/Os makes it well suited for complex digital systems, connectivity‑intensive designs, and board‑level prototyping where integration density and resource availability are primary concerns.

Designed for teams that need scalable logic and memory resources with standard commercial thermal characteristics, this device supports robust development cycles and integration into systems that rely on high programmable capacity and flexible I/O arrangements.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 5SGXEA4H3F35C4G Stratix V GX FPGA.