5SGXEA4H3F35C2N

The 5SGXEA4H3F35C2N is a Stratix V GX field programmable gate array (FPGA) IC from Intel designed for complex, high‑density digital logic implementations. It provides a large fabric of programmable logic, substantial on‑chip RAM, and a high count of general‑purpose I/O in a 1152‑BBGA FCBGA package.

This device targets commercial electronic systems that require significant logic capacity, embedded memory, and dense I/O connectivity while operating within standard commercial temperature and voltage ranges.

Key Features

• Core Logic  Approximately 420,000 logic elements for implementing large-scale custom logic, datapaths, and state machines.
• Embedded Memory  Approximately 37.9 Mbits of on‑chip RAM to support buffering, FIFOs, and local data storage without external memory for many use cases.
• I/O Density  552 user I/Os providing extensive connectivity for parallel interfaces, control signals, and board‑level I/O routing.
• Package and Mounting  1152‑FBGA (35 × 35) FCBGA package; surface‑mount mounting for high‑density PCB designs.
• Power and Core Voltage  Rated core voltage supply from 870 mV to 930 mV to match platform power delivery and thermal planning.
• Operating Range and Grade  Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS‑compliant material designation for environmental and regulatory alignment.
• Series‑Level Electricals  Datasheet documentation for the Stratix V family includes detailed electrical and switching characteristics, I/O timing, and transceiver specifications for system integration and performance tuning.

Typical Applications

• High‑performance communications  Use the device’s dense logic and rich I/O to implement protocol engines, packet processing, and interface bridging where custom logic and buffering are required.
• Data processing and acceleration  Leverage the large logic fabric and embedded RAM for hardware acceleration tasks, streaming data pipelines, and custom compute kernels.
• Prototyping and system integration  Ideal for complex system prototypes that require high I/O counts and reconfigurable logic for iterative development and validation.

Unique Advantages

• Substantial logic capacity: The approximately 420,000 logic elements enable large, sophisticated designs without immediate partitioning across multiple devices.
• Significant on‑chip memory: Approximately 37.9 Mbits of embedded RAM reduce dependence on external memory for many buffering and local storage needs.
• High I/O count: 552 I/Os simplify board‑level connectivity and reduce the need for external multiplexing for dense interface requirements.
• Compact, manufacturable package: 1152‑FBGA (35×35) FCBGA in a surface‑mount form factor supports compact PCB layouts and modern assembly processes.
• Commercial temperature and power alignment: Rated for 0 °C to 85 °C operation and a core supply range of 870–930 mV to match typical commercial system power rails.
• RoHS compliance: Materials designation supports environmental regulatory needs for commercial electronics production.

Why Choose 5SGXEA4H3F35C2N?

The 5SGXEA4H3F35C2N combines a large programmable fabric, substantial embedded RAM, and a high I/O count in a compact FCBGA package to address demanding commercial designs that require significant on‑chip resources. Its specification set supports integration into systems needing extensive custom logic, buffering, and dense external interfacing.

Designed and supported within the Stratix V device family, this FPGA is suited for engineering teams building scalable, high‑complexity applications where reproducible electrical characteristics, documented switching behavior, and series‑level transceiver and I/O details are important for system integration and performance tuning.

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