5SGXEA4H3F35C3G

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 37888000 420000 1152-BBGA, FCBGA

Quantity 1,582 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs158500Number of Logic Elements/Cells420000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits37888000

Overview of 5SGXEA4H3F35C3G – Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 37888000 420000 1152-BBGA, FCBGA

The 5SGXEA4H3F35C3G is a Stratix V GX field-programmable gate array delivering 420,000 logic elements and approximately 37.9 Mbits of embedded memory. Packaged in a 1152-BBGA (FCBGA) 35×35 form factor with surface-mount mounting, it provides 552 user I/Os and is offered as a commercial-grade device.

Designed for designs that demand large programmable logic capacity, substantial on-chip RAM, and a high I/O count, this device addresses complex digital integration requirements while operating within a core supply range of 820 mV to 880 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

  • Core & logic capacity – 420,000 logic elements providing a large programmable fabric; the device data lists 158,500 LABs supporting that capacity.
  • Embedded memory – Approximately 37.9 Mbits (37,888,000 bits) of on-chip RAM for buffering and state storage without external memory.
  • I/O density – 552 user I/O pins to support multiple interfaces and parallel channels.
  • Package & mounting – 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35); surface-mount mounting for compact PCB integration.
  • Power – Core supply range specified from 820 mV to 880 mV to match system power-rail design requirements.
  • Temperature & grade – Commercial grade device with an operating temperature range of 0 °C to 85 °C.
  • Environmental compliance – RoHS compliant for environmental and regulatory alignment.
  • Documented electrical characteristics – Part of the Stratix V family; datasheet includes electrical and switching characteristics, operating conditions, and power guidance for design integration.

Typical Applications

  • High-density logic systems – Implement complex, large-scale custom logic with the device’s 420,000 logic elements.
  • High I/O aggregation – Use the 552 I/Os to consolidate multiple interfaces and signal channels on a single FPGA.
  • Memory‑intensive processing – Leverage approximately 37.9 Mbits of embedded RAM for buffering, look-up tables, and on-chip data storage.

Unique Advantages

  • Large programmable fabric: 420,000 logic elements enable integration of complex algorithms and multiple functional blocks on a single device.
  • Significant on-chip RAM: Approximately 37.9 Mbits of embedded memory reduces dependency on external memory and simplifies board-level design.
  • High I/O count: 552 user I/Os provide flexible connectivity options for multi-channel and multi-protocol applications.
  • Compact, manufacturable package: 1152-BBGA (35×35) FCBGA in a surface-mount form factor supports dense PCB layouts and automated assembly.
  • Commercial temperature rating: Rated 0 °C to 85 °C to meet standard commercial deployment requirements.
  • RoHS compliant: Meets common environmental compliance expectations for commercial electronics.

Why Choose 5SGXEA4H3F35C3G?

The 5SGXEA4H3F35C3G positions itself as a high-capacity, commercial-grade Stratix V GX FPGA suitable for designs that require extensive programmable logic, significant on-chip RAM, and broad I/O capability within a compact FCBGA package. Its documented electrical and switching characteristics—available in the Stratix V device documentation—support integration into complex digital systems while providing defined operating and power parameters.

This device is well suited to engineering teams and procurement organizations targeting scalable FPGA solutions that balance logic density, embedded memory, and I/O connectivity for commercial-temperature applications. The combination of package density, supply range, and environmental compliance supports robust board-level integration and lifecycle management.

If you would like pricing, availability, or a formal quote for 5SGXEA4H3F35C3G, please request a quote or submit a request for pricing and availability.

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