5SGXEA4H1F35I2N

The 5SGXEA4H1F35I2N is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel. It integrates 420,000 logic elements and approximately 37.9 Mbits of embedded memory with 552 user I/Os, packaged in a high-density 1152-BBGA, FCBGA footprint.

Designed and specified for industrial use, this device supports surface-mount assembly, a core supply range of 870 mV to 930 mV, and an operating temperature range of −40 °C to 100 °C, providing a compact, high-capacity fabric for demanding designs.

Key Features

• Core Logic  420,000 logic elements for high-capacity programmable logic and complex design implementation.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support buffering, on-chip data storage, and intermediate processing.
• I/O Density  552 I/Os to accommodate extensive external device and bus connectivity without external multiplexing.
• Power Supply  Core voltage supply range from 870 mV to 930 mV, enabling defined low-voltage core operation.
• Package & Mounting  1152-BBGA, FCBGA package with supplier device package listed as 1152-FBGA (35x35); designed for surface-mount assembly.
• Industrial Temperature Grade  Rated operating temperature from −40 °C to 100 °C for industrial-environment deployment.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density logic designs  Suitable where up to 420,000 logic elements are required for large-scale programmable logic implementations.
• I/O-intensive systems  Systems that need extensive external interfacing can leverage the device's 552 I/Os to reduce external glue logic.
• Industrial electronics  Industrial-grade temperature range (−40 °C to 100 °C) and surface-mount packaging support deployment in industrial environments.

Unique Advantages

• High integration density: High logic element count and substantial on-chip RAM reduce the need for external FPGA companions or memory components.
• Extensive I/O capability: 552 I/Os enable complex system interfacing and simplify board-level routing for multi-channel designs.
• Industrial readiness: Specified industrial operating temperature range supports designs targeted at harsher operating conditions.
• Compact, manufacturable package: 1152-BBGA, FCBGA (supplier package: 1152-FBGA (35x35)) optimized for surface-mount assembly and space-constrained layouts.
• Defined low-voltage core operation: 870 mV–930 mV supply range provides clear power requirements for system power budgeting.
• Regulatory compliance: RoHS compliance simplifies environmental and manufacturing considerations.

Why Choose 5SGXEA4H1F35I2N?

The 5SGXEA4H1F35I2N positions itself as a high-capacity Stratix V GX FPGA that combines substantial logic resources, large embedded memory, and a very high I/O count in a single surface-mount package. Its industrial temperature rating and clearly specified power requirements make it suitable for designers seeking a compact, reliable programmable fabric for demanding applications.

This device is well-suited for teams and projects that require scalability of logic and memory on a compact board footprint, backed by Intel’s Stratix V device family specifications and RoHS compliance for streamlined manufacturing and lifecycle planning.

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