5SGXEA4H1F35C2LG

The Intel Stratix V GX FPGA 5SGXEA4H1F35C2LG is a high-density programmable logic device in the Stratix V GX family designed for applications that require large logic capacity, significant embedded memory, and broad I/O connectivity. It combines a high count of logic elements with substantial on-chip RAM and a compact ball-grid array package.

This device provides 420,000 logic elements, approximately 37.9 Mbits of embedded memory, and 552 I/O pins in a 1152-BBGA (FCBGA) package. Key electrical characteristics include a core voltage supply range of 820 mV to 880 mV and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core (Logic Capacity)  420,000 logic elements (158,500 LABs) for large-scale, programmable digital logic implementations.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory in many designs.
• High I/O Count  552 dedicated I/O pins to enable extensive peripheral, bus, and subsystem interfaces directly from the device.
• Package & Mounting  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) with surface-mount mounting for space-efficient board integration.
• Power  Core supply range of 820 mV to 880 mV provides defined operating conditions for power planning and supply design.
• Operating Range & Grade  Commercial device grade with an operating temperature range of 0 °C to 85 °C.
• Series-Level Transceiver Capability  Part of the Stratix V GX family, which the device datasheet documents with selectable transceiver speed grades for high-speed serial channel support in the family.
• Compliance  RoHS-compliant manufacturing status for environmental and regulatory alignment.

Typical Applications

• High-density digital processing  Large logic capacity and on-chip RAM make this device suitable for complex digital functions such as packet processing, protocol handling, and custom compute blocks.
• High I/O aggregation  With 552 I/O pins, it supports designs that require dense peripheral or bus interfacing and multi-channel connectivity.
• Embedded buffering and local memory  Approximately 37.9 Mbits of embedded memory enables on-chip buffering and data staging to reduce external memory dependence.
• Compact system integration  1152-BBGA (35×35) packaging supports compact, surface-mount board layouts where area and integration density are important.

Unique Advantages

• High logic density:  420,000 logic elements provide the capacity to implement complex, large-scale designs without immediate migration to multiple devices.
• Substantial on-chip memory:  Approximately 37.9 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• Extensive external connectivity:  552 I/O pins enable rich peripheral integration and high-channel counts for interface-heavy applications.
• Compact packaging:  1152-BBGA, FCBGA (35×35) package offers a dense, surface-mount form factor suitable for space-constrained systems.
• Defined electrical envelope:  Clear core supply range (820 mV–880 mV) and commercial temperature rating simplify power and thermal planning for typical embedded environments.
• RoHS compliance:  Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose 5SGXEA4H1F35C2LG?

The 5SGXEA4H1F35C2LG delivers a balanced combination of logic density, embedded memory, and high I/O count in a compact FCBGA package, making it suitable for designs that demand significant on-chip resources and dense connectivity. Its defined core voltage range and commercial temperature rating help streamline system-level power and thermal design considerations.

Choose this Stratix V GX device when your project requires large-scale programmable logic, substantial local memory, and extensive I/O support within a compact, RoHS-compliant package. The device is backed by the Stratix V family documentation for designers who need series-level electrical and transceiver guidance.

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