5SGXEA4H1F35I2G

The 5SGXEA4H1F35I2G is a Stratix V GX field programmable gate array (FPGA) offered in an industrial temperature grade. It provides a substantial logic fabric and on-chip memory tailored for designs that require large programmable logic resources, significant embedded RAM, and high I/O density.

This device is specified for surface-mount deployment in a 1152-BBGA (supplier package: 1152-FBGA, 35×35) and is intended for applications that must operate across an industrial temperature range with defined core voltage supply limits.

Key Features

• Core Logic  420,000 logic elements for implementing complex digital logic, custom datapaths, and large-scale programmable functions.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM (37,888,000 bits) to support large buffering, LUT-based storage, and state retention within the FPGA fabric.
• I/O Density  552 user I/O pins to accommodate extensive peripheral interfacing, parallel buses, and multi-channel I/O requirements.
• Packaging & Mounting  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) designed for surface-mount PCB assembly.
• Voltage Supply  Device core supply specified between 870 mV and 930 mV, enabling predictable power domain planning.
• Temperature & Grade  Industrial grade with operating temperature range from −40 °C to 100 °C for deployment in thermally demanding environments.
• Environmental Compliance  RoHS compliant, meeting common regulations for restricted substances.

Typical Applications

• High-density programmable logic systems  Leverage 420,000 logic elements and large embedded RAM for complex digital designs and custom accelerators.
• Industrial control and instrumentation  Industrial temperature rating (−40 °C to 100 °C) and robust packaging support deployment in factory and field environments.
• High I/O interfacing  With 552 I/O pins, the device supports designs that require extensive peripheral connectivity and multi-channel I/O.

Unique Advantages

• Large programmable resource pool: 420,000 logic elements enable implementation of complex state machines, datapaths, and custom hardware accelerators without external logic.
• Substantial on-chip memory: Approximately 37.9 Mbits of embedded RAM reduces dependence on external memory for buffering and temporary storage.
• High I/O count: 552 user I/Os simplify board-level routing for multi-channel systems and dense peripheral interfacing.
• Industrial-grade thermal range: Rated from −40 °C to 100 °C for reliable operation in challenging temperature conditions.
• Compact BGA packaging: 1152-BBGA (35×35) balances board-space efficiency with high pin count for dense system integration.
• Regulatory compliance: RoHS compliance supports environmentally constrained product designs.

Why Choose 5SGXEA4H1F35I2G?

The 5SGXEA4H1F35I2G positions itself as a high-capacity Stratix V GX FPGA option for designs requiring a large number of logic elements, significant on-chip RAM, and extensive I/O. Its industrial temperature rating and defined core voltage range make it suitable for robust, long-life deployments where thermal tolerance and predictable power domains matter.

This device is well suited to engineering teams and procurement looking for a high-density programmable platform that supports complex logic integration and high I/O counts while meeting RoHS requirements and standard surface-mount assembly practices.

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