5SGXEA4H1F35C2LN

The 5SGXEA4H1F35C2LN is a Stratix V GX Field Programmable Gate Array (FPGA) in a 1152-BBGA (1152-FBGA, 35×35) surface-mount package. It delivers high logic density, abundant embedded memory, and a large I/O count for demanding commercial designs that require extensive programmable logic and system integration.

With 420,000 logic elements, approximately 37.9 Mbits of on-chip RAM and 552 I/O pins, this Stratix V GX device targets applications that need high-capacity programmable fabric, substantial embedded memory resources, and broad external connectivity while operating within standard commercial temperature ranges.

Key Features

• Core Logic  420,000 logic elements for implementing large-scale digital logic, algorithms and custom accelerators.
• Embedded Memory  Approximately 37.9 Mbits of on-chip RAM to support buffering, state storage and data-path implementations.
• I/O and Connectivity  552 user I/O pins to support extensive external interfaces and multi-channel connectivity.
• Package & Mounting  1152-BBGA / 1152-FBGA (35×35) FCBGA package, surface-mount mounting for high-density board designs.
• Power  Core voltage supply range of 0.820 V to 0.880 V, enabling low-voltage core operation and power-optimized designs.
• Temperature & Grade  Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-capacity digital processing  Implement large custom datapaths and logic with 420,000 logic elements and substantial embedded RAM.
• Networking and communications modules  Use the high I/O count to interface multiple channels and external transceivers in commercial networking equipment.
• Data acceleration and offload  Deploy programmable accelerators and data-path logic that benefit from integrated memory and dense logic resources.
• Prototype and system integration  Leverage the FCBGA footprint and extensive I/O for board-level prototyping and integration into commercial systems.

Unique Advantages

• High logic density: 420,000 logic elements enable complex designs and consolidation of multiple functions into a single device.
• Large on-chip memory: Approximately 37.9 Mbits of embedded RAM reduce external memory dependency and improve data throughput.
• Extensive I/O: 552 I/O pins support broad interfacing options and simplify integration with high-channel-count systems.
• Compact, production-ready package: 1152-FBGA (35×35) surface-mount package balances density and manufacturability for commercial products.
• Low-voltage core operation: 0.820–0.880 V supply supports power-conscious core designs.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation, suitable for standard commercial environments.

Why Choose 5SGXEA4H1F35C2LN?

The 5SGXEA4H1F35C2LN combines very high logic capacity, substantial embedded memory and a large I/O complement in a production-ready FCBGA package. Its specifications make it well suited for commercial designs that require dense programmable logic, significant on-chip RAM, and extensive external connectivity while operating within standard commercial temperature limits.

This device is appropriate for engineering teams and OEMs designing high-capacity programmable systems where consolidation of functions, reduced external BOM, and robust board-level integration are priorities. RoHS compliance and surface-mount packaging support modern manufacturing and regulatory needs.

Request a quote or submit your RFQ to get pricing and availability for the 5SGXEA4H1F35C2LN.