5SGXEA3K3F40I3LG

The 5SGXEA3K3F40I3LG is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel. It provides a high-density programmable logic fabric with integrated embedded memory and a large I/O count in a 1517-BBGA FCBGA package.

Designed for logic- and I/O-intensive applications, this industrial-grade device combines 340,000 logic elements, approximately 19.456 Mbits of embedded RAM, and up to 696 I/Os. The Stratix V GX family datasheet also documents high-speed transceiver capability across defined speed grades for series devices.

Key Features

• Logic Capacity  340,000 logic elements to implement complex custom logic, state machines, and datapaths.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive functions.
• I/O Density  Up to 696 general-purpose I/Os to support large numbers of external interfaces and parallel buses.
• Transceiver Capability (Series)  Stratix V GX series documentation includes high-speed transceiver speed-grade options for serial links (series-level specification).
• Package and Mounting  1517-BBGA (FCBGA) / supplier device package 1517-FBGA (40×40) in a surface-mount format for high-density board integration.
• Power Supply  Core voltage supply specified from 820 mV to 880 mV (0.82 V–0.88 V) for core operation.
• Industrial Temperature Grade  Rated operating temperature range of −40 °C to 100 °C for industrial environments.
• Compliance  RoHS-compliant build for global environmental compliance.

Typical Applications

• High-density programmable logic  Implement large custom logic blocks and complex state machines using 340,000 logic elements and abundant embedded RAM.
• I/O-intensive systems  Designs requiring extensive external interfacing benefit from up to 696 I/Os for parallel interfaces, control buses, and peripheral connectivity.
• High-speed serial and protocol bridging  Stratix V GX series transceiver capability (series-level specification) supports designs that integrate high-speed serial links and protocol conversion.

Unique Advantages

• High integration density: 340,000 logic elements and substantial on-chip RAM reduce the need for external glue logic and discrete memory components.
• Large I/O count: Up to 696 I/Os enable consolidation of multiple interfaces on a single device, simplifying board-level routing and BOM.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Compact, board-ready package: 1517-BBGA (1517-FBGA 40×40) surface-mount package facilitates high-density PCB designs.
• Controlled core power range: Defined 820 mV–880 mV core supply allows predictable power sequencing and integration into regulated power domains.
• Environmental compliance: RoHS status indicates adherence to common environmental material requirements.

Why Choose 5SGXEA3K3F40I3LG?

The 5SGXEA3K3F40I3LG Stratix V GX FPGA combines large-scale programmable logic, substantial on-chip memory, and a very high I/O count in an industrial-grade package. Its specifications make it suitable for designs that require dense logic integration, extensive external connectivity, and support for series-level high-speed transceiver capabilities.

As an Intel Stratix V GX device, it provides a platform for scalable, high-performance hardware implementations where deterministic logic resources, embedded RAM, and I/O density are primary design drivers.

Request a quote or submit an inquiry for pricing and availability to evaluate 5SGXEA3K3F40I3LG for your next high-density FPGA design.