5SGXEA3K3F40I3L

The 5SGXEA3K3F40I3L is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in an industrial temperature grade. It combines a high density of logic resources with multi-megabit embedded RAM and an extensive I/O count for complex, high‑density programmable designs.

Designed for systems that require significant on-chip logic, memory and I/O integration, this device delivers a large resource set in a 1517‑BBGA FCBGA package with surface‑mount mounting and RoHS compliance.

Key Features

• Core Logic — 340,000 logic elements and 128,300 logic blocks provide substantial programmable fabric for complex digital designs.
• Embedded Memory — Approximately 19.456 Mbits of on‑chip RAM for buffering, FIFOs and embedded data storage.
• I/O Capacity — 696 user I/O pins to support dense peripheral and interface routing requirements.
• Package & Mounting — 1517‑BBGA (FCBGA) package, supplier device package listed as 1517‑FBGA (40×40); surface mount device.
• Power — Core voltage supply range from 820 mV to 880 mV as specified for device operation.
• Thermal & Grade — Industrial grade device rated for an operating temperature range of −40 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• High‑density programmable systems — Large logic element and memory counts enable implementation of complex custom logic and on‑chip data buffering.
• Systems requiring extensive I/O — 696 I/Os support designs with numerous external interfaces or parallel signal requirements.
• Industrial temperature deployments — Rated for −40 °C to 100 °C operation to meet demanding thermal environments.

Unique Advantages

• High logic density: 340,000 logic elements allow consolidation of large functional blocks into a single device, reducing BOM complexity.
• Substantial on‑chip memory: Approximately 19.456 Mbits of embedded RAM minimizes external memory needs for many designs.
• Extensive I/O footprint: 696 I/Os provide flexibility for routing multiple interfaces without external multiplexing.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Compact, manufacturable package: 1517‑BBGA FCBGA surface‑mount package supports standard assembly processes and dense PCB layouts.
• Standards‑oriented supply range: Core voltage specification (820–880 mV) enables precise power planning and margining.

Why Choose 5SGXEA3K3F40I3L?

The 5SGXEA3K3F40I3L positions itself as a high‑capacity Stratix V GX FPGA option for designs that need a large programmable fabric, multi‑megabit embedded memory and a very high I/O count in an industrial‑grade device. Its combination of resources and package form factor makes it suitable for consolidating complex digital functions into a single IC, simplifying system design and board real estate.

Backed by Intel’s Stratix V family documentation and specifications, this device provides predictable electrical and thermal characteristics for engineering evaluation and system integration, supporting long‑term design stability and supply continuity.

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