5SGXEA3K3F40C3N

The 5SGXEA3K3F40C3N is a Stratix® V GX field programmable gate array (FPGA) from Intel, offered in a 1517‑FBGA package. It delivers high programmable logic density and extensive I/O capacity for complex digital designs.

With 340,000 logic elements and approximately 19.456 Mbits of embedded memory, this commercial‑grade FPGA targets applications that require large on‑chip logic capacity, significant embedded RAM, and broad external interfacing while operating within a commercial temperature range.

Key Features

• Logic Capacity  340,000 logic elements (cells) to implement large, highly parallel digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on‑chip RAM for data buffering, FIFOs, and local storage.
• I/O Resources  696 user I/O pins to support wide external interfaces and dense board connectivity.
• Package and Mounting  1517‑BBGA / FCBGA package; supplier device package listed as 1517‑FBGA (40×40); surface mount construction for standard PCB assembly processes.
• Power  Voltage supply specified at 820 mV to 880 mV, enabling designs that target the Stratix V core voltage range.
• Temperature Grade  Commercial grade operation from 0°C to 85°C for standard commercial deployments.
• Standards Compliance  RoHS compliant.
• Stratix V Family Transceiver Capability  The Stratix V family documentation includes GX transceiver channel support (series data shows GX up to 14.1 Gbps and related transceiver grades), useful when designing high‑speed serial interfaces using Stratix V GX devices.

Typical Applications

• High‑density digital switching  Large programmable logic capacity and abundant I/O make this device suitable for complex state machines, protocol handling, and datapath implementations.
• Memory buffering and on‑chip storage  Significant embedded RAM supports buffering, packet queues, and local data storage for throughput‑oriented designs.
• High‑speed serial interface designs  Stratix V GX family transceiver capabilities support designs that integrate multi‑Gbps serial links within the FPGA architecture.

Unique Advantages

• Extensive logic resource  340,000 logic elements allow consolidation of multiple functions into a single device, reducing board complexity.
• Generous on‑chip RAM  Approximately 19.456 Mbits of embedded memory reduces dependence on external memory for many buffer and caching applications.
• High I/O count  696 I/O pins facilitate wide parallel buses and multiple peripheral interfaces without additional multiplexing hardware.
• Commercial temperature suitability  Rated 0°C to 85°C for standard commercial environments, matching typical production and lab conditions.
• Industry‑standard package  1517‑FBGA (40×40) surface‑mount package supports common assembly processes and board layouts for high‑density designs.
• RoHS compliant  Meets material restriction requirements for environmentally conscious designs.

Why Choose 5SGXEA3K3F40C3N?

The 5SGXEA3K3F40C3N positions itself as a high‑capacity Stratix V GX FPGA delivering substantial logic resources, sizeable on‑chip RAM, and a large number of I/O pins in a 1517‑FBGA package. Its commercial temperature rating and RoHS compliance make it appropriate for mainstream electronic products and development platforms that require significant programmable logic and embedded memory.

This device is well suited for engineering teams building complex digital systems, high‑bandwidth interfaces, and designs that benefit from consolidating multiple functions into a single, high‑density FPGA. The Stratix V family documentation provides transceiver performance guidance for designs utilizing GX transceivers within the series.

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