5SGXEA3K3F40C2L

The 5SGXEA3K3F40C2L is a Stratix V GX family FPGA from Intel, offered in a 1517-BBGA (FCBGA) package. It provides a high-density programmable fabric with a large logic element count, substantial embedded memory, and extensive I/O capability for demanding digital designs.

Designed for commercial temperature operation, this device targets applications that require high logic capacity, significant on-chip RAM, and a high number of I/Os while operating at a low core voltage range.

Key Features

• Logic Capacity  Contains 340,000 logic elements, enabling implementation of complex digital designs and large-scale programmable logic resources.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM for buffering, state storage, and memory-intensive functions.
• I/O Density  696 user I/O pins to support dense external connectivity and multi-channel interfacing.
• Package & Mounting  1517-BBGA FCBGA package (supplier package: 1517-FBGA, 40×40) in a surface-mount form factor for compact board integration.
• Power  Core supply operating range of 820 mV to 880 mV to support low-voltage core operation.
• Temperature & Grade  Commercial grade device rated for an operating temperature range of 0 °C to 85 °C.
• Standards & Compliance  RoHS compliant, meeting common lead-free and environmental requirements.

Typical Applications

• High-density digital processing  Use the device’s 340,000 logic elements to implement complex datapaths, state machines, and custom processing cores.
• Memory-intensive functions  Approximately 19.46 Mbits of embedded RAM support buffering, packet queuing, and intermediate data storage on-chip.
• Multi-channel I/O systems  696 I/Os enable interfacing with numerous peripherals, sensors, and parallel data lanes for system integration.

Unique Advantages

• High logic integration: 340,000 logic elements reduce reliance on external ASICs or multiple discrete devices for large designs.
• Substantial on-chip memory: Approximately 19.46 Mbits of embedded RAM minimizes external memory needs and lowers system BOM complexity.
• Extensive external connectivity: 696 I/Os provide flexibility for dense peripheral interfacing and multi-channel architectures.
• Compact, manufacturable package: 1517-BBGA (FCBGA) surface-mount package supports compact PCB layouts and automated assembly.
• Low-voltage core operation: 820–880 mV supply range supports modern low-voltage system architectures.
• Commercial temperature suitability: Rated 0 °C to 85 °C for deployments in standard commercial environments.

Why Choose 5SGXEA3K3F40C2L?

The 5SGXEA3K3F40C2L delivers a high-capacity Stratix V GX FPGA option for designers who require large-scale programmable logic, significant embedded RAM, and extensive I/O in a single surface-mount package. Its combination of 340,000 logic elements, approximately 19.46 Mbits of on-chip memory, and 696 I/Os makes it suitable for complex digital systems where integration and on-chip resources reduce external components and simplify board design.

As a commercial-grade device from Intel, this Stratix V GX part suits customers focused on performance and integration within standard temperature ranges, offering a scalable platform for advanced FPGA-based development and deployment.

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