5SGXEA3K3F35I4G

The 5SGXEA3K3F35I4G is an Intel Stratix® V GX field programmable gate array (FPGA) in a 1152-ball BGA package. It delivers high fabric capacity and significant on-chip memory, making it suitable for complex digital designs that require large logic and memory resources. The device is offered in an industrial temperature grade and supports a core voltage supply range of 820 mV to 880 mV.

Key Features

• Core Capacity  Approximately 340,000 logic elements for high-density logic integration and complex design implementation.
• Logic Array  128,300 logic array resources as specified in device data for granular logic partitioning.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
• I/O Count  432 user I/Os to accommodate extensive external interfacing and parallel connectivity.
• Transceiver-Class Device  Stratix V GX family device; Stratix V datasheet documents GX transceiver speed grade options for high-speed serial links.
• Package & Mounting  1152-BBGA / FCBGA (supplier package: 1152-FBGA 35×35) in a surface-mount form factor for board-level integration.
• Powering  Core voltage supply range: 820 mV to 880 mV to match board power rail design requirements.
• Industrial Temperature Grade  Operating temperature range: −40 °C to 100 °C for industrial-environment deployments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital processing  Leverage the large logic element count and embedded RAM for complex FPGA-based compute and control tasks.
• High-speed serialization and communications  As a Stratix V GX device, it supports transceiver-grade operation appropriate for designs that use high-speed serial interfaces.
• Custom signal processing  On-chip memory and extensive logic resources enable real-time processing and buffering for signal and packet processing engines.
• Prototype and system integration  Surface-mount 1152-ball BGA package and abundant I/Os simplify integration into production boards and evaluation platforms.

Unique Advantages

• Substantial logic and memory density: The combination of ~340,000 logic elements and ~19.456 Mbits of embedded RAM supports large, integrated designs without external FPGA fabrics.
• High I/O count: 432 user I/Os enable broad external connectivity and parallel interfacing to peripherals and daughter cards.
• Industrial-grade operation: Rated for −40 °C to 100 °C, suitable for deployments that require an extended operating temperature range.
• Compact BGA package: 1152-ball FCBGA (35×35) provides a high-pin-count solution in a surface-mount footprint for dense board-level implementations.
• Standards-aligned device family: Part of the Stratix V GX family with documented transceiver speed grade options and electrical characteristics in the Stratix V device datasheet.
• RoHS compliance: Conforms to RoHS requirements for lead-free manufacturing and global supply-chain compatibility.

Why Choose 5SGXEA3K3F35I4G?

The 5SGXEA3K3F35I4G positions itself where high logic capacity, substantial embedded memory, and extensive I/O converge in an industrial-grade Stratix V GX FPGA. Its combination of ~340,000 logic elements, approximately 19.456 Mbits of on-chip RAM, and 432 I/Os makes it well suited for complex digital processing, high-speed communication subsystems, and integrated signal-processing applications.

Engineers and procurement teams looking for a high-density, industrial-temperature FPGA with a compact 1152-ball BGA footprint and documented Stratix V GX device characteristics will find this device aligned to demanding board-level integration needs and rigorous operating conditions.

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