5SGXEA3K3F35I3N

The 5SGXEA3K3F35I3N is an Intel Stratix V GX family FPGA in a 1152-ball FCBGA package optimized for high-density logic and rich I/O connectivity. This industrial-grade device combines a large logic fabric with substantial on-chip memory and a wide I/O complement to support complex, performance-oriented designs.

Designed for applications that require large programmable logic capacity and extensive I/O, the device delivers a balance of logic resources, embedded memory, and a compact surface-mount package suitable for demanding embedded and industrial environments.

Key Features

• High Logic Capacity  340,000 logic elements provide a large programmable fabric for complex logic, DSP, and control functions.
• Embedded Memory  Approximately 19.46 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic blocks.
• Extensive I/O  432 user I/O pins to interface with high-pin-count peripherals, multiple parallel buses, or mixed-signal front ends.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for reliable performance across industrial temperature extremes.
• Low-Voltage Core  Core supply range specified at 820 mV to 880 mV to match modern low-voltage power architectures.
• Package and Mounting  1152-BBGA (supplier package: 1152-FBGA, 35 × 35 mm) in a surface-mount form factor for high-density PCB layouts.
• Compliance  RoHS-compliant construction to meet environmental and manufacturability requirements.

Typical Applications

• High-density signal processing  Implement large custom datapath logic and parallel processing architectures using the device's extensive logic resources and on-chip RAM.
• Connectivity and I/O aggregation  Aggregate and bridge multiple high-pin-count interfaces or parallel buses using the 432 I/O pins and flexible packaging.
• Industrial control and automation  Deploy in control systems that require extended temperature operation and robust programmable logic capacity.

Unique Advantages

• Substantial programmable capacity: The combination of 340,000 logic elements and approximately 19.46 Mbits of embedded RAM reduces the need for external memory and discrete logic.
• Broad I/O headroom: 432 I/O pins enable interfacing to a wide variety of peripherals, sensors, and backplane connectors without sacrificing signal density.
• Industrial thermal range: −40 °C to 100 °C rating supports deployments in temperature-challenging environments.
• Compact, high-density package: 1152-ball FCBGA (35 × 35 mm) allows a high-pin-count solution in a manageable board footprint.
• Low-voltage core operation: 820–880 mV supply range aligns with modern low-power FPGA core domains.
• RoHS compliance: Built to meet common environmental and manufacturing standards for lead-free production.

Why Choose 5SGXEA3K3F35I3N?

The 5SGXEA3K3F35I3N positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suitable for designs that demand a large programmable fabric, substantial embedded memory, and extensive I/O in a compact surface-mount package. Its combination of logic density, on-chip RAM, and robust thermal range offers designers a scalable platform for complex signal processing, connectivity aggregation, and industrial control applications.

Manufactured to Intel's Stratix V GX device family specifications, this device is appropriate for engineering teams that require verifiable hardware characteristics—logic capacity, memory, I/O count, package, supply range, and operating temperature—documented for integration into demanding systems.

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