5SGXEA3K3F40C2G

The 5SGXEA3K3F40C2G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1517-FBGA (40×40) package. It delivers high-density programmable logic and abundant I/O for designs that require extensive on-chip resources and flexible interfacing.

With 340,000 logic elements, approximately 19.456 Mbits of embedded memory, and 696 I/Os, this device targets applications that need dense integration, scalable logic capacity, and a wide range of I/O connectivity while operating within a commercial temperature grade.

Key Features

• Core Logic  340,000 logic elements provide high-density programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support large buffers, FIFOs, and state storage without external memory in many use cases.
• I/O Count  696 I/Os enable extensive external interfacing, sensor and peripheral connections, or multi-channel I/O architectures.
• Package & Mounting  Available in a 1517-BBGA FCBGA (1517-FBGA, 40×40) package for surface-mount assembly.
• Power Supply  Operates from a core supply range of 870 mV to 930 mV, allowing explicit power planning for system power rails.
• Operating Temperature  Rated for commercial operation from 0 °C to 85 °C.
• Standards and Compliance  RoHS compliant.
• Stratix V GX Family Attributes  As a Stratix V GX device, it is part of a family with documented electrical and switching characteristics including transceiver and I/O timing information (see series datasheet for family-level details).

Typical Applications

• High‑density digital processing  Use the device where large amounts of programmable logic and on-chip RAM are needed for custom compute pipelines or data-paths.
• High‑pin-count I/O systems  Ideal for systems requiring extensive external interfaces, multi-channel I/O, or complex board-level connectivity.
• Communication and transceiver-enabled designs  Fits designs that leverage Stratix V GX family transceiver capabilities and I/O timing features documented at the series level.
• Prototyping and complex SoC integration  Suitable for integrating large custom logic blocks and peripheral controllers into a single programmable device.

Unique Advantages

• High logic integration: 340,000 logic elements reduce the need for multiple devices by consolidating complex logic into a single FPGA.
• Significant embedded memory: Approximately 19.456 Mbits of on-chip RAM supports large buffering and local data storage to simplify external memory requirements.
• Extensive I/O availability: 696 I/Os enable flexible interfacing options, minimizing multiplexing and external I/O expanders.
• Commercial temperature rating: Specified for 0 °C to 85 °C operation, suitable for a wide range of commercial electronic products.
• Surface-mount FBGA package: 1517-FBGA (40×40) package provides a compact, assembly-friendly form factor for high-pin-count designs.
• RoHS compliant: Meets common environmental compliance requirements for lead-free assembly.

Why Choose 5SGXEA3K3F40C2G?

The 5SGXEA3K3F40C2G combines high-density programmable logic, substantial on-chip memory, and nearly 700 I/Os in a single 1517-FBGA package, enabling designers to consolidate complex systems and reduce board-level component count. Its specified core voltage range and commercial temperature rating make it appropriate for demanding commercial applications that require predictable electrical and thermal planning.

Engineers and procurement teams seeking a Stratix V GX-class device with verified family-level electrical and switching characteristics can leverage the device’s documented attributes to plan performance, I/O budgeting, and system-level integration while relying on Intel’s Stratix V series documentation for detailed transceiver and I/O timing guidance.

Request a quote or submit a sales inquiry to get pricing, availability, and support for integrating the 5SGXEA3K3F40C2G into your next design.