5SGXEA3K2F35I3

The 5SGXEA3K2F35I3 is a Stratix® V GX field programmable gate array (FPGA) IC offering a high-density programmable fabric with 340,000 logic elements and approximately 19.456 Mbits of embedded RAM. Designed for surface-mount implementation, the device provides 432 user I/Os and is packaged in a 1152-ball BGA (FCBGA / 35×35 FBGA) footprint for high I/O routing density.

Rated for industrial operation (–40 °C to 100 °C) and RoHS compliant, this FPGA is targeted at designs that require substantial on-chip logic and memory resources within a compact package and a narrow core-voltage operating window (820 mV to 880 mV).

Key Features

• Core Logic  340,000 logic elements provide substantial programmable capacity for complex digital functions and parallel processing pipelines.
• Embedded Memory  Total on-chip RAM capacity of 19,456,000 bits (approximately 19.456 Mbits) for buffering, state storage, and memory-intensive accelerators.
• I/O Resources  432 user I/Os support a wide range of external interfaces and high-pin-count connectivity requirements.
• Package & Mounting  1152-ball BGA (FCBGA) package; supplier package listed as 1152-FBGA (35×35). Surface-mount mounting for PCB integration in compact layouts.
• Power and Core Voltage  Operates with a core voltage supply range of 820 mV to 880 mV, enabling precise core-power provisioning.
• Industrial Temperature Grade  Specified operating temperature range of –40 °C to 100 °C for deployment in industrial environments.
• Series Transceiver Capabilities (series-level)  Stratix V GX family transceiver speed grades described in the datasheet include GX channel options (series-level) up to 14.1 Gbps.
• Standards & Compliance  RoHS compliant for environmental and manufacturing requirements.

Typical Applications

• High-density logic systems: Designs that require large programmable fabric and substantial on-chip RAM for custom accelerators, signal processing, or complex state machines.
• High I/O interface hubs: Systems that need many external connections—up to 432 I/Os—for board-level aggregation and routing.
• Industrial equipment: Control and processing applications benefiting from the device’s industrial temperature rating (–40 °C to 100 °C) and surface-mount BGA packaging.

Unique Advantages

• High logic density: 340,000 logic elements enable implementation of complex designs and multi-function systems on a single device, reducing component count.
• Significant on-chip RAM: Approximately 19.456 Mbits of embedded memory supports buffering and local data storage for latency-sensitive functions.
• Large I/O capacity: 432 I/Os provide flexibility for multi-channel I/O, interface bridging, and rich peripheral connectivity without external expanders.
• Industrial-grade thermal range: Specified operation from –40 °C to 100 °C helps ensure reliable operation in demanding environments.
• Compact, manufacturable package: 1152-ball FCBGA (35×35) surface-mount package balances routing density with PCB assembly compatibility.
• Controlled core-voltage window: Narrow operating voltage range (820 mV–880 mV) for predictable power budgeting and supply design.

Why Choose 5SGXEA3K2F35I3?

The 5SGXEA3K2F35I3 combines a high count of logic elements, extensive embedded RAM, and a large I/O complement in a compact 1152-ball BGA package, making it suitable for designs that consolidate multiple functions into a single FPGA. Its industrial temperature rating and RoHS compliance support deployment in robust, long-life systems where environmental tolerance and regulatory compliance matter.

This device is well suited to teams building high-density programmable solutions that require predictable power characteristics and broad on-chip resources, enabling scalable designs that leverage the Stratix V GX family’s documented electrical and transceiver characteristics.

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