5SGXEA3K2F35I2N

The 5SGXEA3K2F35I2N is an Intel Stratix® V GX field‑programmable gate array (FPGA) provided in an industrial temperature grade. It integrates a high digital logic capacity and substantial on‑chip RAM to support complex, high‑density programmable logic designs.

Key value propositions include large logic density, approximately 19.46 Mbits of embedded memory, a 432‑pin I/O footprint, and a compact 1152‑BBGA (FCBGA) package — all designed for surface‑mount PCB assembly and operation across an extended industrial temperature range.

Key Features

• Logic Capacity  Approximately 340,000 logic elements to implement large combinational and sequential logic designs.
• Embedded Memory  Approximately 19.46 Mbits of on‑chip RAM for buffering, state storage, and local data processing.
• I/O Count  432 user I/O pins to support diverse peripheral interfaces and parallel connectivity.
• Package & Mounting  1152‑BBGA, FCBGA supplier device package (1152‑FBGA (35x35)), optimized for surface‑mount PCB implementations.
• Voltage Supply  Operates from 820 mV to 880 mV per the device specification.
• Temperature & Grade  Industrial grade device specified for an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑density digital processing  Leverage the large logic element count and embedded RAM for complex signal processing pipelines and algorithm acceleration.
• High‑speed communications  Stratix V GX family devices include GX transceiver capability (as documented in the device series datasheet), suitable for applications that require multi‑Gbps serial links.
• Custom hardware acceleration  Use the device’s logic capacity and memory to offload compute‑intensive tasks and implement deterministic hardware‑level processing.

Unique Advantages

• High logic density: Approximately 340,000 logic elements enable integration of large, complex designs into a single device, reducing system BOM.
• Substantial embedded memory: Approximately 19.46 Mbits of on‑chip RAM provides local buffering and state storage without external memory.
• Robust industrial operation: Rated for −40 °C to 100 °C operation and listed as industrial grade for deployments in demanding environments.
• Compact, high‑pin package: 1152‑BBGA (FCBGA) with surface‑mount mounting supports high I/O counts in a space‑efficient footprint.
• Low core supply range: Operates between 820 mV and 880 mV, matching designs targeting this voltage window.
• Regulatory compliance: RoHS compliance supports environmentally driven product requirements.

Why Choose 5SGXEA3K2F35I2N?

The 5SGXEA3K2F35I2N positions itself as a high‑density Stratix V GX FPGA option for designers who require large programmable logic capacity, significant on‑chip memory, and extensive I/O in an industrial‑grade package. Its combination of approximately 340,000 logic elements, roughly 19.46 Mbits of embedded RAM, and 432 I/O pins enables consolidation of complex functions into a single FPGA device.

This device is appropriate for development teams and systems integrators building high‑performance digital processing, communications, or hardware acceleration solutions that demand extended temperature operation and a compact, high‑pin‑count FCBGA package.

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