5SGXEA3K2F35I2LG

The 5SGXEA3K2F35I2LG is a Stratix V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers a high-density programmable logic resource with 340,000 logic elements and approximately 19.456 Mbits of embedded RAM for complex digital designs.

Packaged in a 1152-BBGA (1152-FBGA 35×35) surface-mount package and specified for industrial temperature operation, this device is built for designs that require large logic capacity, extensive I/O (432 pins), and controlled core-voltage operation.

Key Features

• Logic Capacity  340,000 logic elements provide substantial programmable fabric for complex state machines, signal processing, and custom logic implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage.
• I/O Density  432 user I/O pins accommodate wide parallel interfaces and multiple peripheral connections without external multiplexing.
• Package & Mounting  Supplied in a 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA 35×35) for surface-mount assembly and compact PCB integration.
• Power / Core Voltage  Core supply voltage range is specified at 820 mV to 880 mV for precise power planning and design validation.
• Operating Temperature  Industrial grade rating with an operating range from −40 °C to 100 °C for extended environmental tolerance.
• Supplier & Documentation  Part of the Intel Stratix V family with available device datasheet and electrical characteristics documentation.

Typical Applications

• High-density programmable logic  Implement large custom logic blocks, complex state machines, and hardware-accelerated algorithms using the device's extensive logic and memory resources.
• Multi-interface systems  Deploy wide parallel buses and multiple peripheral interfaces leveraging the 432 I/O pins to simplify board-level design.
• Industrial control and instrumentation  Use the industrial temperature rating and robust package for applications that must operate across a wide temperature range.
• High-bandwidth data buffering  Leverage on-chip RAM for buffering, packet queues, and intermediate data storage in data-path designs.

Unique Advantages

• Large programmable fabric:  340,000 logic elements enable integration of complex functionality that reduces external component count and simplifies system architecture.
• Generous on-chip memory:  Approximately 19.456 Mbits of embedded RAM supports deep buffering and local data storage, improving throughput and latency for data-intensive designs.
• High I/O count:  432 I/O pins allow direct connections to multiple peripherals and wide data buses, minimizing the need for additional interface chips.
• Industrial temperature capability:  Rated from −40 °C to 100 °C for deployment in environments with wide temperature variation.
• Surface-mount, high-density package:  1152-BBGA (1152-FBGA 35×35) package supports compact PCB layouts while providing large I/O and logic capacity.
• Precise core-voltage spec:  820 mV to 880 mV core supply range supports controlled power design and integration into regulated power architectures.

Why Choose 5SGXEA3K2F35I2LG?

The 5SGXEA3K2F35I2LG positions itself as a high-capacity Stratix V GX FPGA option offering a combination of large logic resources, substantial embedded RAM, and a high I/O count within a compact 1152-BBGA package. Its industrial temperature rating and defined core-voltage range make it suitable for designs that require predictable electrical characteristics and extended environmental tolerance.

This device is appropriate for engineers and system designers targeting dense programmable logic, extensive peripheral interfacing, and on-chip buffering in industrial and high-I/O applications. Documentation for the Stratix V family is available to support implementation and electrical characterization of the part.

Request a quote or submit an inquiry for pricing and availability to evaluate the 5SGXEA3K2F35I2LG for your next design.