5SGXEA3H3F35C2L

The 5SGXEA3H3F35C2L is a Stratix V GX field programmable gate array offered in a 1152-BBGA (FCBGA) package for surface-mount assembly. As a commercial-grade Stratix V GX device, it provides large-scale programmable logic, abundant embedded memory, and a broad set of I/O suitable for demanding digital designs.

Engineered for applications that require high logic density and system integration, this device targets designs where on-chip memory, large numbers of logic elements, and numerous I/O are key design drivers.

Key Features

• High Logic Density — 340,000 logic elements to implement complex digital functions and large-scale system logic.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM for buffers, FIFOs, and local storage.
• Extensive I/O — 432 I/O pins to support wide parallel interfaces, multiple I/O banks, and flexible board-level connectivity.
• Stratix V GX Transceiver Capability — As part of the Stratix V GX family (per datasheet), GX channels are supported with listed transceiver speed grades up to 14.1 Gbps, enabling high-speed serial interfaces where applicable.
• Power and Voltage — Core supply operating range from 820 mV to 880 mV to match platform power-rail designs.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for commercial applications.
• Package and Mounting — 1152-BBGA, FCBGA (supplier package: 1152-FBGA, 35×35 mm) in a surface-mount form factor for compact system integration.
• Regulatory — RoHS compliant for reduced environmental impact in manufacturing.

Typical Applications

• High-density digital processing — Implement complex state machines, datapaths, and custom accelerators using the device’s 340,000 logic elements and large embedded RAM.
• High-speed serial interfaces — Leverage Stratix V GX transceiver capabilities for serializer/deserializer links and other high-speed communications where GX channel support is required.
• Multi-channel I/O systems — Use the 432 I/O for broad parallel connectivity, multi-lane interfaces, and mixed-signal front-end interaction.
• Platform integration — Integrate glue logic, protocol bridges, and system controllers in a single FPGA package to reduce board-level component count.

Unique Advantages

• Large-scale integration: 340,000 logic elements consolidate complex functions into one FPGA, reducing external logic and simplifying board layout.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM minimizes dependence on external memory for buffering and local datasets.
• Rich I/O capability: 432 I/Os provide flexible interface options and support for multiple parallel buses or peripheral channels.
• Commercial temperature suitability: Rated 0 °C to 85 °C to match standard commercial operating environments.
• Compact BGA footprint: 1152-BBGA, surface-mount package (35×35 mm supplier package) enables dense system-level packaging and reliable soldered interconnect.
• Standards-conscious manufacturing: RoHS compliance supports environmentally responsible production processes.

Why Choose 5SGXEA3H3F35C2L?

The 5SGXEA3H3F35C2L positions itself as a high-density, commercially rated Stratix V GX FPGA designed for systems that require substantial logic resources, on-chip memory, and broad I/O capability in a surface-mount BBGA package. Its combination of 340,000 logic elements, approximately 19.456 Mbits of embedded RAM, and 432 I/O pins makes it suitable for consolidating complex digital subsystems and reducing external component count.

With a defined core supply voltage range and commercial temperature rating, this device fits designs where predictable electrical characteristics and a compact, high-pin-count package are essential. As part of the Stratix V GX family, it is aligned with documented transceiver options in the series for high-speed serial applications as noted in the device family datasheet.

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