5SGXEA3H2F35I3LN

The 5SGXEA3H2F35I3LN is an Intel Stratix V GX field-programmable gate array (FPGA) supplied in a 1152-BBGA FCBGA package. It delivers a high-density programmable fabric paired with abundant on-chip memory and a large I/O count for complex digital designs.

Built for applications that require substantial logic capacity and extensive I/O, this industrial-grade device offers low-voltage core operation and a wide operating temperature range suitable for demanding environments. Refer to the device datasheet for detailed electrical and switching characteristics and transceiver options available in the Stratix V GX family.

Key Features

• High-density logic: 340,000 logic elements to implement large-scale logic, custom datapaths, and control systems.
• Embedded memory: Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and embedded data storage.
• I/O capacity: 432 user I/O pins to support extensive parallel interfaces, bus bridges, and system connectivity.
• Package & mounting: 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, 35×35) designed for surface-mount PCB assembly.
• Power and core voltage: Core voltage supply range of 820 mV to 880 mV for the programmable fabric.
• Industrial temperature grade: Rated for operation from −40 °C to 100 °C to meet industrial deployment requirements.
• Standards compliance: RoHS compliant.

Typical Applications

• High-speed communications: Implement dense protocol logic and leverage Stratix V GX family transceiver options for multi-gigabit serial interfaces (see datasheet for family transceiver specifications).
• Data processing & acceleration: Large logic and memory resources enable custom accelerators, packet processing, and complex control logic.
• Industrial controls: Industrial temperature rating and extensive I/O make the device suitable for factory automation, motion control, and system orchestration.
• Prototyping and system integration: High I/O count and large programmable fabric support hardware emulation, prototype platforms, and system integration tasks.

Unique Advantages

• Large programmable fabric: The 340,000 logic elements provide headroom for complex designs and multi-function integration, reducing the need for multiple discrete devices.
• Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory lowers external memory dependency and simplifies board-level design.
• Extensive I/O: 432 I/Os support wide parallel interfaces and flexible system connectivity without excessive external multiplexing.
• Industrial robustness: Rated for −40 °C to 100 °C operation to support deployment in demanding environments.
• Compact surface-mount package: The 1152-BBGA (1152-FBGA, 35×35) package balances density and manufacturability for modern PCB layouts.
• Low-voltage core: 820 mV–880 mV core supply range suitable for low-voltage FPGA ecosystems and careful power budgeting.

Why Choose 5SGXEA3H2F35I3LN?

The 5SGXEA3H2F35I3LN combines high logic density, significant embedded memory, and a large I/O complement in a surface-mount FCBGA package, making it well suited for designs that require integration of complex digital functions and extensive interfacing. Its industrial temperature rating and RoHS compliance provide durability for harsh environments while aligning with modern manufacturing and environmental requirements.

Designers targeting high-density programmable solutions with substantial on-chip RAM and broad I/O capability will find this device applicable for communication systems, data processing acceleration, industrial automation, and system prototyping where scalable, robust FPGA resources are required.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXEA3H2F35I3LN. Our team can assist with procurement and provide the device datasheet for detailed electrical and timing specifications.