5SGXEA3H2F35I3G

The 5SGXEA3H2F35I3G is a Stratix® V GX field-programmable gate array (FPGA) manufactured by Intel. It delivers high logic density, substantial embedded memory, and a large I/O count in a 1152-BBGA surface-mount package targeted for industrial-temperature applications. This device is suited for designs that require extensive programmable logic, on-chip RAM, and robust thermal range support.

Key Features

• Core and Logic Capacity  340,000 logic elements (cells) to implement high-density digital logic and complex programmable functions.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for large buffering, lookup tables, and state storage.
• I/O and Package  432 user I/O pins in a 1152-BBGA, FCBGA package; supplier package listed as 1152-FBGA (35×35). Device is surface-mount.
• Power and Operating Conditions  Core supply voltage range from 820 mV to 880 mV; industrial operating temperature range from -40°C to 100°C.
• Industrial Grade  Device is specified as industrial grade to support applications requiring extended temperature operation.
• Environmental Compliance  RoHS compliant.
• Documentation  Detailed electrical and switching characteristics, I/O timing, and operating conditions are available in the Stratix V device datasheet.

Typical Applications

• High-density digital systems  Implement large custom logic blocks and complex state machines using up to 340,000 logic elements and substantial on-chip RAM.
• High-channel I/O platforms  Designs that require dozens to hundreds of user I/O pins can leverage the device’s 432 I/O for system integration and peripheral interfacing.
• Industrial embedded equipment  Suitable for industrial-temperature deployments where operation from -40°C to 100°C is required.
• Platform prototyping and integration  Use the Stratix V GX device for prototyping and integration tasks that demand high logic density and large embedded memory.

Unique Advantages

• High logic density: 340,000 logic elements enable implementation of large, complex designs without immediate migration to multiple devices.
• Significant on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for buffering and LUT storage.
• Extensive I/O capability: 432 I/O pins provide flexibility for multi-channel interfaces and broad peripheral connectivity.
• Industrial temperature operation: Rated from -40°C to 100°C for deployment in environments with wide thermal variation.
• Compact, manufacturable package: 1152-BBGA (1152-FBGA supplier package, 35×35) in a surface-mount form factor suited to modern PCB assembly.
• Standards-aware manufacturing: RoHS compliance supports environmental and regulatory requirements.

Why Choose 5SGXEA3H2F35I3G?

The 5SGXEA3H2F35I3G combines high logic capacity, substantial embedded memory, and a large I/O complement in an industrial-temperature, surface-mount BBGA package. It is a solid choice for engineers and system architects who need programmability, on-chip resources, and environmental robustness in a single FPGA device. Backed by the Stratix V family documentation, the device is positioned for designs requiring scalable logic resources and long-term availability from a major manufacturer.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXEA3H2F35I3G. Technical documentation is available in the Stratix V device datasheet for detailed electrical and switching characteristics.