5SGXEA3H2F35I2N

The 5SGXEA3H2F35I2N is an industrial-grade Stratix V GX FPGA from Intel, delivered in a 1152-ball FCBGA/FBGA package. It provides a high-density programmable fabric with 340,000 logic elements and approximately 19.456 Mbits of embedded memory for complex digital designs.

Designed for demanding embedded and communications applications, this device offers 432 user I/Os, a low-voltage core supply range, and an extended operating temperature range suitable for industrial deployments.

Key Features

• Logic Capacity — 340,000 logic elements to implement large-scale digital functions and custom accelerators.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM for buffering, state machines, and local storage.
• I/O — 432 user I/Os to support broad connectivity and parallel interfaces.
• Package & Mounting — 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting type for standard PCB assembly.
• Power — Core voltage supply range of 870 mV to 930 mV for the device core.
• Temperature Range — Industrial operating range from –40°C to 100°C for use in extended-environment systems.
• Compliance — RoHS compliant.

Typical Applications

• High-performance networking — Implement packet processing, protocol bridging, and custom data-path logic using the large logic count and abundant I/O.
• Telecommunications equipment — Use embedded memory and dense logic for framing, buffering, and real-time signal control in base stations and switching equipment.
• Industrial control — Leverage the industrial temperature rating and flexible I/O to handle motor control, motion systems, and factory automation interfaces.
• Custom compute acceleration — Deploy application-specific accelerators and preprocessing blocks where large programmable fabric and on-chip RAM reduce external memory dependence.

Unique Advantages

• High integration density: 340,000 logic elements and substantial embedded RAM enable complex, consolidated designs that reduce external component count.
• Extensive I/O capability: 432 user I/Os support multiple parallel interfaces and high-pin-count system integration without additional bridging logic.
• Industrial robustness: Specified for –40°C to 100°C operation, suitable for extended-temperature deployments.
• Compact ball-grid packaging: 1152-ball FCBGA/FBGA package provides a high-pin-count solution in a compact surface-mount footprint for space-constrained PCBs.
• Controlled core voltage: Narrow core supply range (870 mV–930 mV) for predictable power-domain design and integration.
• Standards-compliant materials: RoHS compliance supports environmentally constrained production requirements.

Why Choose 5SGXEA3H2F35I2N?

The 5SGXEA3H2F35I2N combines large programmable capacity, substantial embedded RAM, and extensive I/O in an industrial-grade Stratix V GX FPGA package. It is suited to engineers building high-performance networking, telecommunications, industrial control, or custom acceleration solutions that require dense logic, local memory, and robust operating temperature support.

With a compact 1152-ball BGA package and a defined core voltage range, this device supports predictable system integration and PCB designs targeting industrial environments while maintaining compliance with RoHS material requirements.

Request a quote or submit an inquiry for pricing and availability for the 5SGXEA3H2F35I2N to evaluate this device for your next design.