5SGXEA3H2F35I3LG

The 5SGXEA3H2F35I3LG is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1152‑FBGA (35×35) FCBGA package for surface‑mount applications. It delivers a large logic fabric and embedded memory alongside a high I/O count and industrial temperature rating, making it suitable for complex, high‑density digital designs.

Built on the Stratix V GX family architecture, this device targets designs requiring substantial on‑chip resources, high‑speed serial transceiver capability (as defined by the Stratix V GX series), and reliable operation across an industrial temperature range.

Key Features

• Logic Capacity  Approximately 340,000 logic elements and 128,300 logic blocks provide a large programmable fabric for complex logic, state machines, and custom accelerators.
• Embedded Memory  Approximately 19.46 Mbits of on‑chip RAM to support buffers, FIFOs, and memory‑intensive processing functions.
• I/O Density  432 device I/Os to accommodate wide parallel interfaces, multiple high‑speed links, and extensive peripheral connectivity.
• Transceiver Capability (Series)  Stratix V GX family transceiver support as specified in the device series datasheet, for high‑speed serial communications (series‑level specification).
• Power and Core Voltage  Core supply operating range of 820 mV to 880 mV to match system power‑delivery designs that target this device family.
• Package and Mounting  1152‑FBGA (35×35) FCBGA package, surface mount, enabling compact, high‑density board layouts.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for reliable performance in industrial environments.
• RoHS Compliant  Device is RoHS compliant, meeting common environmental requirements for electronic components.

Typical Applications

• High‑density logic integration  Large logic and block RAM capacity support complex FPGA designs such as protocol handling, custom datapaths, and hardware acceleration.
• Memory‑intensive processing  Nearly 19.46 Mbits of embedded RAM enables buffering, packet processing, and streaming applications that require sizable on‑chip storage.
• High‑I/O systems  With 432 I/Os, the device is well suited for applications needing broad parallel interfaces or multiple peripheral connections.
• Industrial systems  The –40 °C to 100 °C operating range and industrial grade make it appropriate for industrial control, instrumentation, and other rugged deployments.

Unique Advantages

• High logic density: The combination of ~340,000 logic elements and ~128,300 logic blocks enables large, consolidated FPGA designs that reduce the need for multiple devices.
• Substantial on‑chip RAM: Approximately 19.46 Mbits of embedded memory reduces external memory dependence and improves latency for buffering and streaming tasks.
• Extensive I/O: 432 I/Os provide flexibility to interface with wide buses, sensors, peripherals, and multiple protocol endpoints.
• Industrial temperature rating: –40 °C to 100 °C specification supports deployment in demanding environmental conditions.
• Compact FCBGA package: The 1152‑FBGA (35×35) package enables dense PCB layouts while delivering large silicon capacity.
• Low‑voltage core operation: Core supply range of 0.82–0.88 V aligns with modern, efficient power‑delivery designs.

Why Choose 5SGXEA3H2F35I3LG?

This Intel Stratix V GX FPGA combines large programmable logic, significant embedded memory, and a high I/O count in a compact 1152‑FBGA package, positioned for complex digital designs and industrial applications. The device’s specifications support high‑density integration, memory‑centric processing, and robust operation across a wide temperature range.

Designers seeking a scalable, well‑documented FPGA option for demanding applications will benefit from the device’s resource balance, series‑level transceiver capabilities, and the breadth of technical documentation available for the Stratix V family.

Request a quote or submit a pricing inquiry to evaluate 5SGXEA3H2F35I3LG for your next design and obtain procurement and lead‑time information.