5SGXEA3H2F35C3G

The 5SGXEA3H2F35C3G is a Stratix V GX field programmable gate array from Intel, supplied in a 1152-BBGA (35×35) FCBGA package for surface-mount assembly. This commercial-grade FPGA provides a large logic fabric and substantial embedded memory, delivering a platform for designs that require high logic density, extensive I/O, and configurable on-chip memory.

As a member of the Stratix V GX family (per the series datasheet), the device supports the GX-class transceiver options defined in the Stratix V documentation and is RoHS compliant for commercial deployments.

Key Features

• Logic Capacity  Approximately 340,000 logic elements to implement large-scale digital designs and complex RTL.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Resources  432 user I/O pins to support dense peripheral and interface connectivity.
• Package & Mounting  1152-BBGA, FCBGA package (supplier device package: 1152-FBGA 35×35) with surface-mount mounting for compact board integration.
• Power Supply  Core voltage supply range: 820 mV to 880 mV for device operation within specified electrical conditions.
• Commercial Temperature Grade  Rated operating temperature: 0 °C to 85 °C, intended for commercial applications.
• Regulatory Compliance  RoHS compliant.
• Stratix V GX Series Characteristics  Part of the Stratix V GX family with the transceiver and core speed grades described in the Stratix V device datasheet.

Typical Applications

• High-density logic designs  Implement large-scale FPGA logic and custom processing engines using the device's ~340,000 logic elements and extensive embedded memory.
• High I/O systems  Support complex interfacing and multiple parallel peripherals with 432 available user I/O.
• Compact board integration  Leverage the 1152-BBGA (35×35) surface-mount package for space-constrained commercial products and systems.

Unique Advantages

• Substantial logic resources  The large logic element count enables implementation of complex algorithms and large datapaths without external logic expansion.
• Significant on-chip RAM  Approximately 19.456 Mbits of embedded memory reduces dependence on external memory for many buffering and storage tasks.
• High I/O count  432 I/O pins provide flexibility for dense connectivity and multiple interface standards on a single device.
• Commercial-grade specification  Rated for 0 °C to 85 °C operation and RoHS compliant for mainstream commercial product use.
• Compact, manufacturable package  1152-BBGA (35×35) FCBGA package supports surface-mount assembly for modern PCB manufacturing.

Why Choose 5SGXEA3H2F35C3G?

The 5SGXEA3H2F35C3G delivers a balance of high logic capacity, substantial embedded memory, and ample I/O in a single commercial-grade Stratix V GX device. Its defined core voltage range and operating temperature make it suitable for commercial deployments where a dense, integrated FPGA solution is required.

This device is well suited for engineering teams and product designers who need a scalable, high-density programmable fabric with significant on-chip RAM and I/O to consolidate system functions and reduce external component count. The Stratix V GX family support documented in the series datasheet provides a foundation for designs that reference the family’s transceiver and performance characteristics.

Request a quote or submit an inquiry to receive pricing and availability for 5SGXEA3H2F35C3G and to discuss how this Stratix V GX FPGA can fit your next commercial design.