5SGXEA3H2F35C2N

The 5SGXEA3H2F35C2N is a Stratix® V GX field programmable gate array (FPGA) from Intel (Altera). It delivers very high logic capacity and on-chip memory in a high-pin-count FCBGA package, making it suitable for designs that require dense logic, substantial embedded RAM, and extensive I/O.

As a member of the Stratix V GX family, this commercial-grade device targets applications that benefit from large programmable logic resources, significant embedded memory, and a wide I/O complement while operating within a standard commercial temperature range.

Key Features

• Core Logic Capacity  340,000 logic elements (cells) providing a high level of integration for complex programmable logic designs.
• Logic Array Blocks  128,300 logic array blocks to structure and distribute logic resources across the device.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for large buffers, FIFOs, and memory-intensive functions.
• I/O Resources  432 dedicated I/O pins to support extensive system interfacing and high-pin-count designs.
• Package  1152-BBGA, FCBGA (supplier package: 1152-FBGA 35×35) offering a high-density ball-grid footprint for surface-mount assembly.
• Power Supply  Core voltage requirement of 870 mV to 930 mV for the device core supply domain.
• Temperature Grade  Commercial operating temperature range of 0 °C to 85 °C.
• Mounting  Surface-mount package for standard PCB assembly processes.
• Compliance  RoHS compliant.

Typical Applications

• High-density FPGA compute  Use the large logic element count and abundant embedded RAM for complex logic fabrics, hardware acceleration, and custom compute blocks.
• Communications and networking  The Stratix V GX family context and extensive I/O support lane and protocol implementations and system interfacing in networking equipment.
• Data buffering and packet processing  Approximately 19.456 Mbits of on-chip RAM enable sizeable buffering and packet queuing for real-time data flows.
• System integration and prototyping  High I/O count and dense logic resources simplify consolidation of multiple functions into a single device for system prototypes and integration tasks.

Unique Advantages

• High logic density: 340,000 logic elements allow designers to implement large, consolidated logic designs without partitioning across multiple devices.
• Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory reduces dependency on external memory for many buffering and state-storage needs.
• Extensive I/O availability: 432 I/O pins provide flexibility for complex board-level interfacing and multiple peripheral connections.
• High-pin-count FCBGA package: 1152-ball FBGA (35×35) packaging supports high-density routing and compact system layouts while remaining surface-mount compatible.
• Commercial temperature rating: Qualified for 0 °C to 85 °C operation for typical commercial electronics deployments.
• Controlled core voltage: Narrow core supply range (870 mV–930 mV) that aligns with power delivery design for optimized core operation.

Why Choose 5SGXEA3H2F35C2N?

The 5SGXEA3H2F35C2N combines very high logic and memory resources with a large I/O complement in a compact, high-ball-count FCBGA package—delivering a platform for integrating complex functions into a single commercial-grade FPGA. As part of the Stratix V GX family from Intel (Altera), it is suitable for designs that require dense programmability, significant on-chip RAM, and flexible interfacing.

For engineering teams targeting high-integration FPGA solutions, this device offers a balance of capacity, memory, and I/O to support consolidation and prototyping while leveraging the Stratix V family documentation and vendor device support referenced in the product datasheet.

If you would like pricing, availability, or a formal quote for part number 5SGXEA3H2F35C2N, please submit a request and our team will follow up with the details.