5SGXEA3H2F35C2G

The Intel 5SGXEA3H2F35C2G is a Stratix® V GX field-programmable gate array (FPGA) IC designed for high-density, I/O-rich digital designs. Its architecture delivers a combination of large logic capacity, substantial on-chip memory, and a high number of I/Os to address complex system integration needs.

Key value is provided through raw capacity and integration: 340,000 logic elements, approximately 19.456 Mbits of embedded memory, 432 general-purpose I/Os, a 1152‑FBGA (35×35) surface-mount package, and a low-voltage core supply range (870–930 mV) for efficient operation in commercial-temperature applications.

Key Features

• Core Logic Capacity 340,000 logic elements (cells) enable implementation of large, parallel logic fabrics and complex finite-state machines without external logic expansion.
• Embedded Memory Approximately 19.456 Mbits of on-chip RAM to support buffering, lookup tables, and memory-intensive algorithms directly on the FPGA fabric.
• I/O Density 432 I/O pins suitable for designs that require numerous external interfaces, parallel buses, or dense sensor/actuator connectivity.
• Power and Voltage Core supply range of 870 mV to 930 mV provides the defined operating window for the device’s internal logic power rail.
• Package & Mounting 1152‑BBGA FCBGA package (supplier: 1152‑FBGA, 35×35) delivered in a surface-mount form factor for compact board integration and standardized assembly.
• Operating Grade & Temperature Commercial grade device with an operating temperature range of 0 °C to 85 °C suitable for standard commercial electronic systems.
• Standards Compliance RoHS-compliant construction meets common environmental directives for lead-free assembly and materials.

Typical Applications

• High-density logic implementations Architectures and systems that require large numbers of logic elements for complex control, signal processing, or algorithm acceleration.
• Memory-intensive on-chip processing Designs that benefit from substantial embedded RAM for buffering, lookup tables, and state storage without relying on external memory.
• I/O-rich system interfaces Systems with many external connections—parallel buses, sensors, or peripheral interfaces—leveraging the device’s 432 I/Os for direct integration.

Unique Advantages

• High integration density: 340,000 logic elements reduce the need for multiple discrete devices, simplifying board design and BOM.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM supports large internal buffers and accelerates data-path implementations.
• Extensive external connectivity: 432 I/Os provide flexibility to interface with numerous peripherals, sensors, or parallel data streams.
• Compact surface-mount package: 1152‑FBGA (35×35) package optimizes PCB area while providing a robust mechanical format for production assembly.
• Defined low-voltage operation: Core supply specification (870–930 mV) allows predictable power design and regulator selection for the FPGA core.
• Commercial-temperature suitability: Rated 0 °C to 85 °C for standard commercial deployments where that temperature range is required.

Why Choose 5SGXEA3H2F35C2G?

The 5SGXEA3H2F35C2G positions itself as a high-capacity Stratix V GX FPGA option for designs that demand large logic resources, significant embedded memory, and abundant I/O. Its combination of 340,000 logic elements, approximately 19.456 Mbits of on-chip RAM, and 432 I/Os makes it suitable for complex digital systems where integration and deterministic on-chip resources matter.

This commercial-grade FPGA in a 1152‑FBGA surface-mount package offers a clear mechanical and electrical profile—known core voltage range, RoHS compliance, and documented operating temperature—helping engineering and procurement teams evaluate fit for projects that require high-density programmable logic within standard commercial operating conditions.

Request a quote or submit a procurement inquiry to receive pricing and availability for the Intel 5SGXEA3H2F35C2G.