5SGXEA3H2F35C2L

The 5SGXEA3H2F35C2L is a Stratix® V GX field programmable gate array (FPGA) from Intel, delivered in a 1152-ball BGA package for surface-mount integration. It combines high logic density, substantial on-chip memory, and a large I/O count to support complex digital designs.

Built as a commercial-grade Stratix V GX device, this FPGA targets applications that require extensive logic resources, significant embedded memory, and broad I/O capability while operating within a commercial temperature range.

Key Features

• Core & Logic  340,000 logic elements provide high-density programmable logic for complex digital processing and control functions.
• Logic Array Blocks  128,300 logic array blocks support partitioned design and hierarchical architecture implementations.
• Embedded Memory  Approximately 19.456 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage for high-performance designs.
• I/O Capacity  432 I/O pins allow extensive external interfacing for high-channel-count systems and multi-domain connectivity.
• Power Supply  Core voltage range specified at 820 mV to 880 mV, enabling defined power-domain planning for system integration.
• Package & Mounting  1152-BBGA (FCBGA), supplier package listed as 1152-FBGA (35 × 35); intended for surface-mount PCB assembly.
• Operating Conditions  Commercial grade with an operating temperature range of 0°C to 85°C.
• RoHS Compliance  Device is RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High-density digital processing  Implement compute-intensive datapaths and custom accelerators using the large pool of logic elements and embedded RAM.
• High-channel I/O systems  Integrate multi-channel interfaces and peripheral connectivity with 432 available I/O pins for boards requiring broad external connectivity.
• Network and protocol processing  Deploy packet processing, protocol translation, and traffic handling where significant logic and memory are needed.
• System prototyping and integration  Use the commercial-grade Stratix V GX platform for developing and validating complex FPGA-based system designs.

Unique Advantages

• High logic density: 340,000 logic elements enable large, feature-rich FPGA designs without immediate partitioning across devices.
• Substantial embedded memory: Approximately 19.456 Mbits of on-chip RAM reduces external memory dependence for many buffering and storage tasks.
• Extensive I/O capability: 432 I/O pins accommodate multi-protocol and multi-peripheral designs on a single device.
• Defined power envelope: Core voltage specified between 820 mV and 880 mV simplifies power supply design and system-level power budgeting.
• Surface-mount BGA packaging: 1152-ball FCBGA package supports compact board layouts and standard assembly processes.
• Commercial temperature rating: Rated for 0°C to 85°C for applications within commercial environment ranges.

Why Choose 5SGXEA3H2F35C2L?

The 5SGXEA3H2F35C2L positions itself as a high-capacity Stratix V GX FPGA option for designers who need a combination of large logic resources, ample embedded RAM, and broad I/O in a single commercial-grade device. Its defined core voltage range, RoHS compliance, and standardized 1152-ball BGA package make it straightforward to integrate into compact, performance-oriented systems.

This device is well suited for engineering teams developing data-path heavy systems, multi-interface platforms, or prototyping advanced FPGA architectures where logic density and on-chip memory reduce system complexity and external component count.

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