5SGXEA3H2F35C1N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 19456000 340000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 905 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 432 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 128300 | Number of Logic Elements/Cells | 340000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19456000 |
Overview of 5SGXEA3H2F35C1N – Stratix® V GX FPGA, 340,000 logic elements
The 5SGXEA3H2F35C1N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a high-density FCBGA package. This commercial-grade FPGA provides a large programmable fabric with abundant embedded memory and a substantial I/O count, enabling complex digital designs that require high integration and on-chip resources.
Key Features
- Logic Capacity High-density programmable logic with 340,000 logic elements and approximately 128,300 logic array blocks to implement complex algorithms and large-scale logic functions.
- Embedded Memory Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and data-path storage directly within the device.
- I/O Resources 432 user I/Os to support wide parallel interfaces, multiple peripherals, and board-level connectivity requirements.
- Power and Core Supply Core voltage range specified from 870 mV to 930 mV to match system power-rail designs and enable controlled core power delivery.
- Package and Mounting Supplied in a 1152-ball FCBGA/FBGA package (1152-FBGA, 35×35 mm) for surface-mount board assembly and compact system layouts.
- Operating Conditions Commercial temperature grade with an operating range from 0 °C to 85 °C to meet standard ambient conditions for commercial electronics.
- Compliance RoHS-compliant construction for regulatory alignment in applicable markets.
Unique Advantages
- High integration density: The combination of 340,000 logic elements and roughly 19.456 Mbits of embedded RAM reduces the need for external logic and memory, simplifying board design.
- Large I/O footprint: 432 I/Os enable broad interfacing options for parallel buses, multi-lane interfaces, and mixed-signal front-ends.
- Compact system footprint: 1152-ball FCBGA/FBGA packaging provides a high-pin-count solution in a controlled, surface-mount form factor for space-constrained PCBs.
- Deterministic core power window: The specified 870–930 mV core supply assists in stable power delivery planning for high-performance FPGA fabrics.
- Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliance for deployment in commercial electronics applications.
Why Choose 5SGXEA3H2F35C1N?
The 5SGXEA3H2F35C1N delivers a high-capacity Stratix® V GX FPGA fabric in a compact 1152-ball FCBGA package, combining extensive logic resources, substantial on-chip memory, and a high I/O count. It is well suited for commercial electronic designs that require dense programmable logic, significant embedded RAM, and broad interfacing capability while operating within standard commercial temperature ranges.
Choosing this FPGA provides designers with a platform capable of integrating large-scale digital functions and on-chip data storage, enabling consolidation of system functions and streamlined board-level design.
Request a quote or submit an inquiry to get pricing and availability for 5SGXEA3H2F35C1N and to discuss how this Stratix® V GX FPGA can fit your design requirements.

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