5SGXEA3H2F35C1N

IC FPGA 432 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 432 19456000 340000 1152-BBGA, FCBGA

Quantity 905 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O432Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs128300Number of Logic Elements/Cells340000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits19456000

Overview of 5SGXEA3H2F35C1N – Stratix® V GX FPGA, 340,000 logic elements

The 5SGXEA3H2F35C1N is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a high-density FCBGA package. This commercial-grade FPGA provides a large programmable fabric with abundant embedded memory and a substantial I/O count, enabling complex digital designs that require high integration and on-chip resources.

Key Features

  • Logic Capacity  High-density programmable logic with 340,000 logic elements and approximately 128,300 logic array blocks to implement complex algorithms and large-scale logic functions.
  • Embedded Memory  Approximately 19.456 Mbits of on-chip RAM for buffering, FIFOs, and data-path storage directly within the device.
  • I/O Resources  432 user I/Os to support wide parallel interfaces, multiple peripherals, and board-level connectivity requirements.
  • Power and Core Supply  Core voltage range specified from 870 mV to 930 mV to match system power-rail designs and enable controlled core power delivery.
  • Package and Mounting  Supplied in a 1152-ball FCBGA/FBGA package (1152-FBGA, 35×35 mm) for surface-mount board assembly and compact system layouts.
  • Operating Conditions  Commercial temperature grade with an operating range from 0 °C to 85 °C to meet standard ambient conditions for commercial electronics.
  • Compliance  RoHS-compliant construction for regulatory alignment in applicable markets.

Unique Advantages

  • High integration density: The combination of 340,000 logic elements and roughly 19.456 Mbits of embedded RAM reduces the need for external logic and memory, simplifying board design.
  • Large I/O footprint: 432 I/Os enable broad interfacing options for parallel buses, multi-lane interfaces, and mixed-signal front-ends.
  • Compact system footprint: 1152-ball FCBGA/FBGA packaging provides a high-pin-count solution in a controlled, surface-mount form factor for space-constrained PCBs.
  • Deterministic core power window: The specified 870–930 mV core supply assists in stable power delivery planning for high-performance FPGA fabrics.
  • Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliance for deployment in commercial electronics applications.

Why Choose 5SGXEA3H2F35C1N?

The 5SGXEA3H2F35C1N delivers a high-capacity Stratix® V GX FPGA fabric in a compact 1152-ball FCBGA package, combining extensive logic resources, substantial on-chip memory, and a high I/O count. It is well suited for commercial electronic designs that require dense programmable logic, significant embedded RAM, and broad interfacing capability while operating within standard commercial temperature ranges.

Choosing this FPGA provides designers with a platform capable of integrating large-scale digital functions and on-chip data storage, enabling consolidation of system functions and streamlined board-level design.

Request a quote or submit an inquiry to get pricing and availability for 5SGXEA3H2F35C1N and to discuss how this Stratix® V GX FPGA can fit your design requirements.

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