5SGXEA3H1F35C2N

The 5SGXEA3H1F35C2N is a Stratix V GX family field programmable gate array (FPGA) in a high-density FCBGA package. It delivers substantial programmable logic capacity, significant embedded RAM, and a high I/O count for complex, integration‑dense designs.

Configured as a commercial‑grade device, this package-level offering targets applications that require large logic capacity, abundant on‑chip memory, and extensive I/O while operating within a 0 °C to 85 °C ambient range. Series documentation describes Stratix V GX transceiver speed grade options for designs that need configurable high‑speed serial capabilities.

Key Features

• Logic Capacity 340,000 logic elements (cells) to implement large, complex digital designs and custom hardware acceleration.
• Embedded Memory Approximately 19.456 Mbits of on‑chip RAM for buffering, large state machines, and data‑intensive logic.
• I/O Resources 432 user I/O pins to support wide parallel interfaces, high pin‑count peripherals, and board-level integration.
• Power and Core Supply Core voltage supply specified from 870 mV to 930 mV to match low‑voltage core power rails.
• Package and Mounting 1152‑BBGA / FCBGA package; supplier device package listed as 1152‑FBGA (35×35). Surface mount device for standard PCB assembly.
• Operating Temperature Commercial grade operation from 0 °C to 85 °C suitable for a wide range of controlled‑environment applications.
• Compliance RoHS compliant.

Typical Applications

• High‑density programmable logic — Implement large custom datapaths, accelerators, and complex control logic using the device’s 340,000 logic elements.
• Memory‑intensive designs — Use approximately 19.456 Mbits of embedded RAM for buffering, packet storage, and on‑chip data structures.
• High I/O integration — Integrate wide parallel bus interfaces, multiple peripherals, and board-level interconnects with 432 I/O pins.
• Transceiver‑enabled systems — Leverage the Stratix V GX series transceiver options (per device datasheet) where configurable high‑speed serial links are required.

Unique Advantages

• High logic density: Large logic element count enables implementation of complex state machines, custom processors, and hardware accelerators on a single device.
• Significant on‑chip RAM: Approximately 19.456 Mbits of embedded memory reduces dependence on external DRAM for many buffering and storage tasks.
• Extensive I/O resources: 432 I/O pins provide flexibility for connecting to multiple peripherals, bus interfaces, and mezzanine modules.
• Compact BGA footprint: 1152‑FBGA supplier package (35×35) supports dense board layouts while maintaining high pin count.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation for use in standard commercial environments.
• Standards‑aware compliance: RoHS compliance supports environmental and regulatory requirements for assembly.

Why Choose 5SGXEA3H1F35C2N?

The 5SGXEA3H1F35C2N combines substantial programmable logic, ample embedded memory, and a high I/O count in a single commercial‑grade Stratix V GX package. It is well suited to developers needing high integration density and flexible on‑chip resources for complex digital systems.

This part is appropriate for designs that demand scalable logic capacity and significant embedded RAM while operating within standard commercial temperature ranges. Series documentation provides additional electrical and transceiver characteristics to help align device selection with system requirements.

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