5SGXEA3H1F35C2L

The 5SGXEA3H1F35C2L is a Stratix® V GX family FPGA offering high-density programmable logic and embedded memory in a compact FCBGA package. It delivers 340,000 logic elements and a high I/O count for designs that require substantial on-chip resources, deterministic core voltage ranges, and commercial-temperature operation.

This device is targeted at applications that need large logic capacity, significant on-chip RAM, and abundant connectivity while maintaining a surface-mount BGA footprint and RoHS compliance.

Key Features

• Core logic capacity — 340,000 logic elements and 128,300 logic array blocks provide substantial programmable logic for complex designs.
• Embedded memory — Approximately 19.456 Mbits of on-chip RAM to support buffering, LUT-based storage, and memory-intensive logic functions.
• I/O density — 432 I/O pins to support high-pin-count interfaces and multiple peripheral connections.
• Power and supply — Core voltage supply range of 820 mV to 880 mV for defined operating conditions.
• Package and mounting — 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35); surface mount compatible for PCB assembly.
• Temperature grade — Commercial operating temperature range: 0 °C to 85 °C.
• Environmental compliance — RoHS-compliant construction for regulatory and manufacturing compatibility.

Typical Applications

• High-density logic implementations — Large-scale programmable logic designs that require extensive LUTs and logic-array resources.
• Memory-intensive processing — Designs leveraging approximately 19.456 Mbits of embedded RAM for buffering, packet handling, or on-chip data storage.
• High I/O interfacing — Systems requiring dozens to hundreds of external signals using the device’s 432 I/O pins.
• Surface-mount, high-density boards — Applications where an FCBGA (1152-ball) implementation is preferred for space-constrained, high-performance PCBs.

Unique Advantages

• High logic integration: 340,000 logic elements enable consolidation of complex functions into a single device, reducing BOM and board-level partitioning.
• Substantial on-chip memory: Approximately 19.456 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful operations.
• Rich I/O resources: 432 I/O pins provide flexibility for interfacing with multiple high-speed and parallel peripherals.
• Defined core-voltage window: 820–880 mV supply range helps designers target stable core power rails and predictable power sequencing.
• Commercial temperature suitability: Rated 0 °C to 85 °C for mainstream electronic applications where commercial-grade operation is required.
• RoHS compliance: Supports environmentally conscious manufacturing and regulatory requirements.

Why Choose 5SGXEA3H1F35C2L?

5SGXEA3H1F35C2L positions itself as a high-density Stratix® V GX FPGA option when large programmable logic and significant embedded memory are required in a single, surface-mount BGA package. Its combination of 340,000 logic elements, approximately 19.456 Mbits of on-chip RAM, and 432 I/O pins makes it suited to complex digital designs that must balance integration density with flexible interfacing.

For design teams seeking a solution that provides substantial on-chip resources, defined core-voltage requirements, and commercial-temperature operation with RoHS compliance, this device offers a scalable platform backed by the Stratix V family datasheet and package configurations.

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