5SGXEA3H1F35C1N

The 5SGXEA3H1F35C1N is a Stratix V GX family field programmable gate array (FPGA) delivering high logic density and extensive on-chip memory in a compact FCBGA package. This commercial-grade FPGA provides a large pool of logic elements, substantial embedded RAM, and a high pin count, making it suitable for complex I/O-driven and memory-intensive designs.

Device documentation for the Stratix V family includes detailed electrical and switching characteristics, including transceiver and I/O timing parameters, to support design validation and system integration.

Key Features

• Logic Capacity — 340,000 logic elements to implement large-scale combinational and sequential logic.
• Embedded Memory — Approximately 19.456 Mbits of on-chip RAM for data buffering, FIFOs, and mapped memory structures.
• I/O Resources — 432 general I/O pins to support high-pin-count interfaces and board-level connectivity.
• Package & Mounting — 1152-BBGA, FCBGA (supplier device package: 1152-FBGA, 35 × 35 mm) in a surface-mount form factor for dense board integration.
• Power — Core voltage supply range of 870 mV to 930 mV for core power planning and regulator selection.
• Operating Range — Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance — RoHS-compliant to support environmentally conscious designs.
• Family Documentation — Stratix V device datasheet provides electrical characteristics, switching parameters, and I/O timing guidance for design and verification.

Typical Applications

• High-density logic implementations — Use the large pool of logic elements for complex state machines, protocol handling, and large combinational logic blocks.
• Memory-intensive designs — Leverage approximately 19.456 Mbits of embedded RAM for buffers, lookup tables, and temporary storage in data-path applications.
• I/O-centric systems — Deploy where a high number of external interfaces are required; 432 I/Os accommodate multi-channel connectivity and board-level routing.
• Board-level integration — Surface-mount FCBGA package and compact 35 × 35 mm footprint enable space-efficient multi-layer PCB designs.

Unique Advantages

• High logic density: 340,000 logic elements provide capacity for complex implementation without external PLDs.
• Substantial on-chip RAM: Approximately 19.456 Mbits of embedded memory reduces reliance on external memory for many buffering and storage needs.
• Extensive I/O count: 432 I/Os enable flexible interfacing to sensors, FPGAs, ASICs, and peripheral devices.
• Compact, manufacturable package: 1152-FBGA (35 × 35) FCBGA in a surface-mount format supports automated assembly and dense board layouts.
• Low-voltage core operation: Core supply of 0.87–0.93 V supports efficient power budgeting for high-density FPGA designs.
• Commercial temperature grade: Rated 0 °C to 85 °C for mainstream embedded and communications equipment.

Why Choose 5SGXEA3H1F35C1N?

The 5SGXEA3H1F35C1N pairs significant logic capacity and embedded memory with a high I/O count in a compact FCBGA package, making it well suited for designs that require on-chip resources and dense board integration. Its commercial temperature rating and RoHS compliance align with mainstream product development and manufacturing requirements.

Engineers targeting complex interface-heavy systems or memory-rich data paths will find the part’s combination of logic elements, embedded RAM, and I/O resources advantageous for consolidating functions and simplifying board-level system architecture. Detailed family-level electrical and switching documentation is available to support timing, power, and transceiver planning.

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